MATROX Y7108-04散热板 PDF资料
1.产 品 资 料 介 绍：
MATROX Y7108-04 是一款专为图像处理或高性能计算设备设计的散热板，以下是根据其应用场景推测的主要特点。
推测采用高导热系数的铝合金或铜质基底，旨在快速导出核心芯片热量。
表面处理工艺可能为黑色阳极氧化，这有助于增强热辐射效率并防腐蚀。
结构上应为精密CNC加工成型，以确保与Y7108系列板卡芯片的贴合度。
散热片设计可能为密集梳齿状或针状鳍片，旨在最大化有效散热面积。
固定方式推测使用弹簧螺丝或压片结构，以提供均匀压力并保护核心晶圆。
底部接触面可能经过镜面抛光处理，旨在降低接触热阻。
可能预贴了高导热相变硅脂或导热垫，方便直接安装使用。
尺寸规格推测与标准PCIe板卡高度兼容，适配常见的服务器或工控机箱。
散热设计功耗（TDP）能力或许在50W-120W区间，具体取决于实际配置的风扇气流。
若为主动散热，随附的风扇可能支持PWM智能调速，可根据温度自动调节转速。
若为被动散热，则依赖机箱内的风道设计进行空气对流。
接口供电推测采用标准的3针或4针主板风扇插座，电压为DC 12V。
重量控制可能在150g-300g之间，设计上平衡了散热性能与对板卡的承重。
工作温度范围通常符合工业级标准，可能在0°C至60°C之间。
安装时一般需搭配导热硅脂，并建议采用对角线顺序锁紧螺丝以确保平衡。
结尾
综上所述，MATROX Y7108-04 散热板的设计通常围绕高效导热、精确贴合及长期稳定运行展开
MATROX Y7108-04散热板 英文介绍
MATROX Y7108-04 is a heat sink designed specifically for image processing or high-performance computing devices. The following are the main features inferred based on its application scenarios.
It is speculated that the use of high thermal conductivity aluminum alloy or copper substrates aims to quickly dissipate heat from the core chip.
The surface treatment process may involve black anodizing, which helps to enhance thermal radiation efficiency and prevent corrosion.
Structurally, it should be precision CNC machined to ensure proper fit with the Y7108 series board chips.
The design of the heat sink may be dense comb shaped or needle shaped fins, aimed at maximizing the effective heat dissipation area.
The fixed method is speculated to use spring screws or pressure plate structures to provide uniform pressure and protect the core wafer.
The bottom contact surface may undergo mirror polishing treatment to reduce contact thermal resistance.
It may be pre coated with high thermal conductivity phase change silicone grease or thermal pad for easy installation and use.
The size specifications are speculated to be highly compatible with standard PCIe cards and suitable for common servers or industrial control chassis.
The thermal design power consumption (TDP) capability may be in the range of 50W-120W, depending on the actual fan airflow configuration.
If it is active cooling, the accompanying fan may support PWM intelligent speed regulation, which can automatically adjust the speed according to temperature.
If it is passive heat dissipation, it relies on the air duct design inside the chassis for air convection.
The interface power supply is speculated to use standard 3-pin or 4-pin motherboard fan sockets with a voltage of DC 12V.
The weight control may be between 150g-300g, and the design balances the heat dissipation performance with the load-bearing capacity of the board.
The working temperature range usually meets industrial standards and may be between 0 ° C and 60 ° C.
During installation, it is generally necessary to use thermal conductive silicone grease, and it is recommended to use diagonal sequence locking screws to ensure balance.
ending
In summary, the design of MATROX Y7108-04 heat dissipation plate usually revolves around efficient heat conduction, precise bonding, and long-term stable operation
MATROX Y7108-04散热板 产品展示
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4.英文产品
DSMB-01C 3AFE64691929 power supply board
DSMB-02C 3AFE64666606 power supply board
HIMA ELOPII software
| 169PLUS-10C-120VAC | PA206Q-135 | 820-23075-000 |
| 169PLUS-100P-240 | PA206Q-133 | F31X121PCRAEG1 |
| 169PLUS-100P-120 | PA200V-135 | 500-22560-000 |
| 169PLUS-100N-125VDC | PA200V-133 | 710-658041-00 |
| 169-120N-120 | PA15T-133 | 073-650069-00 |
| 169-10C-120 | PA10T-133 | 710-613108-001 |
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