LOGOSOL LPA812-3-V76C1预对准器 PDF资料
1.产 品 资 料 介 绍：
LOGOSOL LPA812-3-V76C1 预对准器为美国LOGOSOL公司旗下产品，专为半导体制造中的超大尺寸晶圆预对准设计，适用于涂胶、光刻、薄膜沉积及刻蚀等工艺前的快速精准定位。
适用于特大尺寸晶圆的高精度对准。
采用LED光源与CCD传感器，实现非接触式测量。
对准时间小于2.5秒，效率高。
集成扫描电子元件，属于Class 1兼容设计。
支持3英寸至12英寸多种晶圆尺寸。
可处理透明、半透明、带孔及不透明晶圆。
兼容平边和缺口晶圆规范。
更换晶圆尺寸无需改造硬件。
连接面板支持侧面和底部两种出线方式。
通常集成于涂胶机、光刻机等主设备中协同工作。
保障工艺重复性与良率。
工业级设计，适应半导体产线连续运行环境。
结构紧凑，便于设备集成与维护。
结尾： LOGOSOL LPA812-3-V76C1 以高速、高精度及广泛的晶圆兼容性，为半导体前道工序提供可靠的预对准解决方案。
LOGOSOL LPA812-3-V76C1预对准器 英文介绍
The LOGOSOL LPA812-3-V76C1 pre aligner is a product of the American company LOGOSOL, designed specifically for pre alignment of ultra large wafers in semiconductor manufacturing. It is suitable for fast and accurate positioning before processes such as coating, photolithography, thin film deposition, and etching.
Suitable for high-precision alignment of oversized wafers.
Using LED light source and CCD sensor to achieve non-contact measurement.
Alignment time is less than 2.5 seconds, high efficiency.
Integrated scanning electronic components, belonging to Class 1 compatible design.
Supports multiple wafer sizes ranging from 3 inches to 12 inches.
Can handle transparent, semi transparent, perforated, and opaque wafers.
Compatible with flat edge and notched wafer specifications.
Changing wafer size does not require hardware modification.
The connection panel supports two types of outgoing lines: side and bottom.
Usually integrated into main equipment such as coating machines and lithography machines for collaborative work.
Ensure process repeatability and yield.
Industrial grade design, suitable for continuous operation environment of semiconductor production lines.
Compact structure, easy to integrate and maintain equipment.
Conclusion: LOGOSOL LPA812-3-V76C1 provides a reliable pre alignment solution for semiconductor pre-processing with high speed, high precision, and wide wafer compatibility.
LOGOSOL LPA812-3-V76C1预对准器 产品展示
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