AMAT 0190-24682温度控制零件 PDF资料
AMAT 0190-24682 温度控制零件是应用材料半导体设备中的关键温控组件,用于工艺腔体、晶圆承载台及加热系统的精密温度调节。
产品应用领域(10条)
化学气相沉积(CVD)设备
物理气相沉积(PVD)设备
等离子体刻蚀设备
快速热退火(RTP)设备
原子层沉积(ALD)设备
晶圆承载台/静电吸盘
设备腔体壁温控制
气体输送管路加热
应用材料 P5000、Centura、Endura 等工艺平台
半导体量产产线及工艺研发实验室
产品参数(3条)
控温范围:-50℃ 至 +300℃
控温精度:±0.1℃ 至 ±0.5℃
控制方式:PID 闭环控制,支持多通道输出
结尾
AMAT 0190-24682 在半导体前道制造设备中承担热管理核心作用,控温精度与长期稳定性直接影响晶圆工艺良率与设备产能。
AMAT 0190-24682 temperature control component is a key temperature control component in applied semiconductor equipment, used for precise temperature regulation of process chambers, wafer carriers, and heating systems.
Product application areas (10 items)
Chemical Vapor Deposition (CVD) Equipment
Physical Vapor Deposition (PVD) equipment
Plasma etching equipment
Rapid Thermal Annealing (RTP) Equipment
Atomic Layer Deposition (ALD) equipment
Wafer carrier/electrostatic suction cup
Equipment cavity wall temperature control
Heating of gas transmission pipeline
Application materials P5000, Centura, Endura and other process platforms
Semiconductor Mass Production Line and Process R&D Laboratory
Product parameters (3 items)
Temperature control range: -50 ℃ to+300 ℃
Temperature control accuracy: ± 0.1 ℃ to ± 0.5 ℃
Control method: PID closed-loop control, supporting multi-channel output
ending
AMAT 0190-24682 plays a core role in thermal management in semiconductor front-end manufacturing equipment, and its temperature control accuracy and long-term stability directly affect wafer process yield and equipment capacity.

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3BHE035301R1003 Communication module
| T22NRHJ-LDN-NS-00 | GESPAC GESDAC-2B 8945 | 061-04790-0012 |
| T21NRLH-LNN-NS-00 | 6SC6120-0FE01 | 125760-01 |
| T21NRLD-LNN-NS-00 | 6SC6170-0FC01 | 6ES5451-4UA12 |
| T21NRLC-LNN-NS-00 | GESPAC GESDMC-2 | 6ES5135-3UA11 |
| T21NRHJ-LNN-NS-00 | 6SC6100-0GA12 | 3500/32M 149986-02 |
| T21NLLC-LNN-NS-00 | CACR-SR15BB1CS | 6ES5441-8MA11 |
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