AMAT 1350-00681 电容式压力计 PDF资料
1.产 品 资 料 介 绍：
AMAT 1350-00681 电容式压力计是应用材料公司为半导体设备配套的高精度真空测量组件，以下为其核心特点与应用领域概述。
产品特点
采用电容式薄膜规测量原理，不受气体种类影响。
专为低压工艺环境设计，适用于0-10 Torr量程。
具备高精度与高重复性，零点稳定性好。
提供0-10V模拟信号输出。
内置温度补偿功能，确保测量可靠性。
采用不锈钢材质与金属密封结构。
响应速度快，支持实时压力监测。
符合SEMI洁净标准，适用于晶圆制造。
产品应用领域
PECVD薄膜沉积设备的反应腔压力监控。
等离子体刻蚀机台的压力反馈。
晶圆传输模块与Load Lock的压力控制。
AMAT Centura、Endura等平台的过程监测。
老旧AMAT设备的维保与改造。
真空镀膜与热处理设备的工艺控制。
科研院所的高真空实验装置测量。
不受气体种类影响的高精度压力监测。
结尾
AMAT 1350-00681 电容式压力计具有精度高、不受气体种类影响、响应快等特点，适用于半导体工艺及真空镀膜等场景的压力监测与控制。
AMAT 1350-00681 capacitive pressure gauge is a high-precision vacuum measurement component provided by Applied Materials for semiconductor equipment. The following is an overview of its core features and application areas.
Product Features
Adopting the principle of capacitive thin film gauge measurement, it is not affected by the type of gas.
Specially designed for low-pressure process environments, suitable for 0-10 Torr range.
It has high precision and repeatability, and good zero stability.
Provide 0-10V analog signal output.
Built in temperature compensation function ensures measurement reliability.
Adopting stainless steel material and metal sealing structure.
Fast response speed, supporting real-time pressure monitoring.
Compliant with SEMI cleanliness standards and suitable for wafer manufacturing.
Product application areas
Monitoring of reaction chamber pressure in PECVD thin film deposition equipment.
Pressure feedback of plasma etching machine.
Pressure control of wafer transfer module and load lock.
Process monitoring on platforms such as AMAT Centura and Endura.
Maintenance and renovation of old AMAT equipment.
Process control of vacuum coating and heat treatment equipment.
Measurement using high vacuum experimental equipment in research institutes.
High precision pressure monitoring unaffected by gas types.
ending
AMAT 1350-00681 capacitive pressure gauge has the characteristics of high accuracy, not affected by gas types, and fast response, and is suitable for pressure monitoring and control in semiconductor processes and vacuum coating scenarios.
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