DAIHEN SVD-121-X0834 对准器 PDF资料
1.产 品 资 料 介 绍：
DAIHEN SVD-121-X0834 对准器，核心特点如下（共15条）：
中间（15条）
达谊恒品牌晶圆对准器，用于半导体晶圆传输腔室。
适配300mm晶圆的刻蚀与沉积等工艺设备。
采用高精度光学扫描传感，非接触式识别晶圆边缘及缺口。
中心定位精度高，偏差控制在微米级。
角度定位精度高，满足高精度工艺要求。
内置高速对准运算程序，单次校准时间短。
采用真空吸附承载平台，适用于硅片及石英晶圆。
伺服旋转模块运行平稳，兼容超薄及易碎晶圆。
符合洁净室标准，低释气低发尘。
具备多组真空压力实时监测功能。
真空泄漏时自动报警，保障工艺安全。
全金属屏蔽壳体，抗电磁干扰能力强。
采用分体模块化结构，便于维护更换。
同时支持缺口与平边两种晶圆基准识别。
结构小巧紧凑，适合狭窄安装空间。
结尾
总之，型号 DAIHEN SVD-121-X0834 具备高精度、高洁净度、模块化等核心优势，是300mm晶圆传输工艺中的关键定位组件。
The DAIHEN SVD-121-X0834 aligner has the following core features (15 in total):
Middle (15 items)
Dayiheng brand wafer aligner, used for semiconductor wafer transfer chambers.
Suitable for etching and deposition process equipment of 300mm wafers.
Adopting high-precision optical scanning sensing, non-contact recognition of wafer edges and notches.
The center positioning accuracy is high, and the deviation is controlled at the micrometer level.
High angle positioning accuracy meets high-precision process requirements.
Built in high-speed alignment calculation program, with short single calibration time.
Adopting a vacuum adsorption support platform, suitable for silicon wafers and quartz wafers.
The servo rotation module runs smoothly and is compatible with ultra-thin and fragile wafers.
Compliant with cleanroom standards, low gas release and low dust generation.
Capable of real-time monitoring of multiple sets of vacuum pressure.
Automatic alarm in case of vacuum leakage to ensure process safety.
All metal shielding shell with strong electromagnetic interference resistance.
Adopting a modular structure for easy maintenance and replacement.
Simultaneously supporting both gap and flat edge wafer benchmark recognition.
Compact and compact in structure, suitable for narrow installation spaces.
ending
In summary, the model DAIHEN SVD-121-X0834 has core advantages such as high precision, high cleanliness, and modularity, and is a key positioning component in the 300mm wafer transfer process.
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| AMAT 0100-71121 | 67771-12050 | 3500/70M 140734-09 |
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