ADLINK TECHNOLOGY 02EM4-SD6G560 印刷电路板 PDF资料
1.产 品 资 料 介 绍:
ADLINK TECHNOLOGY 型号 02EM4-SD6G560 印刷电路板,是一款面向工业嵌入式的紧凑型核心板,具备以下主要特点:
中间(15条)
高密度多层板设计,信号完整性好。
符合COM Express Type 6标准,兼容性强。
支持第六代Intel Core处理器供电管理。
双通道DDR4 SO-DIMM内存插槽,最高2400MHz。
高速接口走线优化,PCIe/USB 3.0/SATA稳定。
集成温度监控,辅助散热管理。
低阻抗电源层设计,纹波小、载流强。
板载存储芯片,支持BIOS在线升级。
提供多路GPIO扩展,连接灵活。
工业级物料选型,支持-20°C~+70°C。
金手指镀层加厚,插拔耐久性高。
模拟地与数字地分离,抗串扰。
预留IPMI相关信号,支持远程监控。
关键节点带过流过压保护,安全性好。
生产经AOI及飞针测试,品质一致。
结尾
总体而言,02EM4-SD6G560 在保证稳定性的同时兼顾扩展便利性,适合各类严苛环境下的嵌入式计算应用
ADLINK TECHNOLOGY 02EM4-SD6G560 印刷电路板 英文介绍
ADLINK TECHNOLOGY model 02EM4-SD6G560 printed circuit board is a compact core board designed for industrial embedded systems, with the following main features:
Middle (15 items)
High density multi-layer board design with good signal integrity.
Compliant with COM Express Type 6 standard, with strong compatibility.
Support power management for sixth generation Intel Core processors.
Dual channel DDR4 SO-DIMM memory slot, up to 2400MHz.
High speed interface routing optimization, PCIe/USB 3.0/SATA stability.
Integrated temperature monitoring to assist in heat dissipation management.
Low impedance power layer design, with small ripple and strong current carrying capacity.
Onboard storage chip, supporting BIOS online upgrade.
Provide multiple GPIO extensions for flexible connections.
Industrial grade material selection, supporting -20 ° C~+70 ° C.
The gold finger coating is thickened, providing high durability for insertion and removal.
Separate analog ground from digital ground to resist crosstalk.
Reserve IPMI related signals and support remote monitoring.
Key nodes are equipped with over-current and over-voltage protection, ensuring good safety.
The production has undergone AOI and flying needle testing, and the quality is consistent.
ending
Overall, 02EM4-SD6G560 balances stability and scalability, making it suitable for embedded computing applications in various harsh environments
ADLINK TECHNOLOGY 02EM4-SD6G560 印刷电路板 产品图片

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