TEL 3887-236819晶圆输送机器人 PDF资料
聊到TEL 3887-236819这个晶圆输送机器人,它是东京电子为半导体工艺机台配套的晶圆传输组件,属于设备自动化搬运系统中的关键执行部件。
特点
作为TEL原厂晶圆传输组件,专门负责工艺腔室与装载模块之间的晶圆取放和传送。
在半导体制造流程中承担晶圆在不同工艺模块间的自动化搬运任务,是产线物料流转的核心环节。
属于TEL设备自动化系统的标准配套部件,与机台的控制系统深度集成。
其工作状态对整机的晶圆传输效率和系统稳定性有直接影响。
作为功能备件,适用于TEL机台传输系统的维护和替换。
参数
货号:TEL 3887-236819。
产品名称:晶圆传输机器人组件。
适配系统:东京电子半导体工艺机台。
供应状态:以功能可用的备件形式供应。
用途
半导体刻蚀、沉积等工艺机台的晶圆自动上下料。
工艺腔室与装载模块之间的晶圆传送。
晶圆在不同工艺模块间的自动化调度和搬运。
TEL机台传输系统的备件替换和维护。
半导体产线自动化物料搬运系统的设备级配套。
总的来说,3887-236819是TEL半导体机台用于晶圆自动化搬运的核心组件,承担着工艺环节间物料传输的关键职能,是产线传输系统中常见的备件选项。
Talking about TEL 3887-236819, a wafer transfer robot, it is a wafer transfer component provided by Tokyo Electronics for semiconductor process machines and is a key execution component in equipment automation handling systems.
Characteristics
As the original wafer transfer component of TEL, it is specifically responsible for wafer retrieval, placement, and transfer between process chambers and loading modules.
The automated handling of wafers between different process modules in the semiconductor manufacturing process is the core link in the material flow of the production line.
Belonging to the standard supporting components of TEL equipment automation system, deeply integrated with the control system of the machine.
Its working status has a direct impact on the wafer transfer efficiency and system stability of the entire machine.
As a functional spare part, it is suitable for maintenance and replacement of TEL machine transmission systems.
parameter
Item number: TEL 3887-236819.
Product Name: Wafer Transfer Robot Component.
Adaptation system: Tokyo Electronic Semiconductor Process Machine.
Supply status: supplied in the form of functional spare parts.
Purpose
Automatic wafer loading and unloading of semiconductor etching, deposition and other process machines.
Wafer transfer between the process chamber and the loading module.
Automated scheduling and handling of wafers between different process modules.
Replacement and maintenance of spare parts for TEL machine transmission system.
Equipment level matching for semiconductor production line automation material handling system.
Overall, 3887-236819 is the core component of TEL semiconductor machines used for automated wafer handling, responsible for the critical function of material transfer between process links, and is a common spare part option in production line transmission systems. v

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