AMAT 0010-28779电动倾斜控制器 PDF资料
聊到AMAT 0010-28779这个电动倾斜控制器，它是应用材料为300mm晶圆工艺机台配备的自动调平模块，主要用于在半导体工艺中精确控制基板支撑面的水平度。
特点
专为300mm晶圆工艺设计，型号中“300mm”明确对应其适配规格。
提供电动化倾斜调节功能，相比传统手动调节方式，能够实现更精准和便捷的调平控制。
在系统中常与调平升降机构配合使用，用于调整基板支撑组件的平面度，以改善工艺均匀性。
常见于刻蚀、沉积等对晶圆表面水平度敏感的等离子体工艺场景，用于补偿工艺偏差。
作为AMAT原厂配套部件，在设计和制造上满足半导体工艺对精度和可靠性的要求。
参数
货号：AMAT 0010-28779。
产品名称：300mm电动倾斜控制器。
关联部件号：常与0190-16362、6-60-AG60-AMAT01等编号关联出现。
产品形态：电动倾斜控制模块或组件。
供应状态：以原厂备件或经功能验证的翻新件形式供应。
用途
300mm晶圆刻蚀和沉积工艺中的基座水平度调节。
等离子体工艺中改善晶圆表面工艺均匀性。
设备日常维护后对基板支撑面进行快速重新校准。
AMAT机台升降调平系统的配套组件。
老旧设备基座调平系统的维护和替换。
总的来说，0010-28779是AMAT针对300mm晶圆工艺开发的电动倾斜控制模块，与传统的机械手动调平方式相比，在调节便利性和精准度上有明显提升，主要用于刻蚀、沉积等对平面度要求较高的工艺环节。
When it comes to the AMAT 0010-28779 electric tilt controller, it is an automatic leveling module equipped for 300mm wafer processing machines, mainly used for precise control of the levelness of the substrate support surface in semiconductor processes.
Characteristics
Specially designed for 300mm wafer process, the "300mm" in the model clearly corresponds to its compatible specifications.
Provide electric tilt adjustment function, which can achieve more precise and convenient leveling control compared to traditional manual adjustment methods.
It is often used in conjunction with a leveling and lifting mechanism in the system to adjust the flatness of the substrate support components and improve process uniformity.
Commonly used in plasma process scenarios such as etching and deposition that are sensitive to wafer surface levelness, used to compensate for process deviations.
As an AMAT original supporting component, it meets the precision and reliability requirements of semiconductor processes in design and manufacturing.
parameter
Item number: AMAT 0010-28779.
Product Name: 300mm Electric Tilt Controller.
Associated part number: often associated with numbers such as 0190-16362, 6-60-AG60-AMAT01.
Product form: Electric tilt control module or component.
Supply status: supplied in the form of original spare parts or refurbished parts that have been functionally validated.
Purpose
Adjustment of pedestal levelness in 300mm wafer etching and deposition processes.
Improve the uniformity of wafer surface processing in plasma technology.
Quickly recalibrate the substrate support surface after daily maintenance of the equipment.
The supporting components of the AMAT machine lifting and leveling system.
Maintenance and replacement of old equipment base leveling system.
Overall, 0010-28779 is an electric tilt control module developed by AMAT for 300mm wafer processes. Compared with traditional mechanical manual leveling methods, it has significant improvements in adjustment convenience and accuracy. It is mainly used in processes such as etching and deposition that require high flatness.
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| PMB33F-20100-02 | DSTA180 57120001-ET | DSQC406 |
| PMB33F-20100-01 | DSQC663 3HAC029818-001/14 | UA C326 AE01 HIEE401481R0001 |
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| PMB33F-10216-03 | PIB-701 700007672 | 6DD2920-0AQ0 |
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