MKS AX7700MTS-02 等离子体源 PDF资料
MKS AX7700MTS-02 等离子体源
该型号为MKS Instruments旗下ASTRON部门生产的Paragon F*系列远程等离子体源（RPS），基于ASTeX技术平台开发，用于半导体工艺中产生下游等离子体。
产品特点
远程设计：等离子体在工艺腔室上游产生，减少对晶圆的离子轰击损伤。
ASTeX平台：基于MKS成熟技术开发，等离子体源领域口碑良好。
工艺优化：Paragon系列针对半导体刻蚀、清洗和沉积工艺需求专门优化。
稳定可靠：适合连续工业运行，二手市场提供原厂翻新版本。
标准供电：三相200-208V电源规格，便于产线部署。
关键信息
品牌：MKS Instruments / ASTRON。
型号：AX7700MTS-02 / Paragon F*。
类型：远程等离子体源（RPS）。
电源规格：三相200-208V。
认证：符合CE标准。
应用领域
半导体刻蚀工艺的下游等离子体供应。
CVD腔体的远程等离子体清洗。
光刻胶去除（Ashing）工艺。
晶圆表面处理和预清洗。
PECVD系统的等离子体配套。
简而言之，MKS AX7700MTS-02是Paragon F*系列的远程等离子体源，基于ASTeX平台，用于半导体刻蚀、清洗和沉积等工艺场景，以远程设计和稳定可靠为核心特点。
MKS AX7700MTS-02 plasma source
This model is the Paragon F * series remote plasma source (RPS) produced by the ASTRON division of MKS Instruments. It is developed based on the ASTeX technology platform and is used to generate downstream plasma in semiconductor processes.
Product Features
Remote design: Plasma is generated upstream of the process chamber to reduce ion bombardment damage to the wafer.
ASTeX platform: developed based on mature MKS technology, with a good reputation in the field of plasma sources.
Process optimization: The Paragon series is specifically optimized for semiconductor etching, cleaning, and deposition process requirements.
Stable and reliable: Suitable for continuous industrial operation, the second-hand market provides original refurbished versions.
Standard power supply: three-phase 200-208V power supply specifications, convenient for production line deployment.
Key information
Brand: MKS Instruments/ASTRON.
Model: AX7700MTS-02/Paragon F *.
Type: Remote Plasma Source (RPS).
Power specification: Three phase 200-208V.
Certification: Complies with CE standards.
Application areas
Downstream plasma supply for semiconductor etching process.
Remote plasma cleaning of CVD chamber.
The process of photoresist removal (Ashing).
Surface treatment and pre cleaning of wafers.
Plasma matching for PECVD system.
In short, MKS AX7700MTS-02 is a remote plasma source for the Paragon F * series, based on the ASTeX platform, used in semiconductor etching, cleaning, and deposition process scenarios, with remote design and stable reliability as its core features.
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