Daihen TW39-000021-11 射频自动匹配器 PDF资料
1.产 品 资 料 介 绍:
Daihen TW39-000021-11 射频自动匹配器是日本大恒(Daihen)为半导体等离子体工艺开发的一款阻抗匹配设备,对应型号 M561,内置 MC-1 控制板(P/N: TWE-100-01)。该产品通过动态匹配射频电源与腔室负载之间的阻抗,最大限度地降低反射功率,确保射频功率高效、稳定地传输至等离子体负载。
一、产品应用领域(10条)
半导体刻蚀工艺(介质刻蚀、金属刻蚀)
半导体化学气相沉积(CVD)
半导体物理气相沉积(PVD)
等离子体增强化学气相沉积(PECVD)
半导体晶圆干法清洗
光刻胶去除(去胶工艺)
晶圆表面活化与灰化处理
平板显示器(FPD)面板制造
太阳能电池板制造
射频感应耦合等离子体(ICP)系统
二、核心产品参数(5条)
产品型号:M561
产品料号:TW39-000021-11
控制板型号:MC-1(P/N: TWE-100-01)
适用设备:AMAT(应用材料)半导体设备
产品状态:该型号目前多作为二手备件在市场流通
结尾: 综上所述,Daihen TW39-000021-11(M561)作为应用材料半导体设备的配套射频自动匹配器,在刻蚀、沉积等等离子体工艺中通过动态阻抗匹配,确保射频能量的高效传输与工艺稳定性
Daihen TW39-000021-11 射频自动匹配器 英文介绍
The Daihen TW39-000021-11 RF automatic matching device is an impedance matching equipment developed by Daihen in Japan for semiconductor plasma processes. It corresponds to model M561 and has an MC-1 control board (P/N: TWE-100-01) built-in. This product dynamically matches the impedance between the RF power supply and the chamber load to minimize reflected power and ensure efficient and stable transmission of RF power to the plasma load.
1、 Product application areas (10 items)
Semiconductor etching process (dielectric etching, metal etching)
Semiconductor Chemical Vapor Deposition (CVD)
Semiconductor Physical Vapor Deposition (PVD)
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Dry cleaning of semiconductor wafers
Photoresist removal (photoresist removal process)
Activation and ashing treatment of wafer surface
Flat Panel Display (FPD) Panel Manufacturing
Manufacturing of solar panels
Radio frequency inductively coupled plasma (ICP) system
2、 Core product parameters (5 items)
Product model: M561
Product part number: TW39-000021-11
Control board model: MC-1 (P/N: TWE-100-01)
Applicable equipment: AMAT (Applied Materials) semiconductor equipment
Product status: This model is currently mostly circulated in the market as a second-hand spare part
Conclusion: In summary, Daihen TW39-000021-11 (M561), as a supporting RF automatic matching device for semiconductor equipment, ensures efficient transmission of RF energy and process stability through dynamic impedance matching in plasma processes such as etching and deposition
Daihen TW39-000021-11 射频自动匹配器 产品图片

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| IC3600SCBN2A | 531X300CCHAEM2 | IC3600SSKC1 |
| IC3600SCBN1B | 531X300CCHADM5 | IC3600SSKB1 |
| IC3600SCBN1 | 531X300CCHADM3 | IC3600SSKA1G1C |
| IC3600SCBM2 | 531X300CCHADM2 | IC3600SSKA1F |
| IC3600SCBL1 | 531X300CCHADM1 | IC3600SSKA1 |
| IC3600SCBK1 | 531X300CCHACM1 | IC3600SSIB1 |
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