MKS AX7700MTS-03 等离子体源 PDF资料
1.产 品 资 料 介 绍:
MKS AX7700MTS-03 等离子体源是 MKS(ASTRON)旗下 Paragon F 系列的一款射频等离子电源,采用远程等离子源(RPS)设计,等离子体在远离工艺腔的独立腔体内生成后输送至晶圆表面,可有效避免电极污染与金属溅射,为半导体及泛半导体行业的关键工艺提供高稳定性、高电离效率、低污染的等离子环境。
一、产品应用领域(10条)
半导体刻蚀工艺(介质刻蚀、导体刻蚀)
半导体化学气相沉积(CVD)
半导体物理气相沉积(PVD)
半导体离子注入工艺
半导体晶圆干法清洗
光刻胶去除(去胶工艺)
晶圆表面活化处理
光伏电池板制造(PECVD 等工艺)
平板显示器(FPD)面板制造
LED 芯片制造
二、核心产品参数(5条)
产品系列:MKS ASTRON Paragon F 系列远程等离子源(RPS)
额定功率:7000 W
工作频率:13.56 MHz ±0.05%
电离效率:≥95%
冷却方式:水冷
结尾: 综上所述,MKS AX7700MTS-03(Paragon F 系列 RPS 远程等离子源)作为半导体及泛半导体行业干法工艺中的主流型号,凭借其 7kW 大功率射频输出、≥95% 的高电离效率及远程等离子体设计,为刻蚀、沉积、清洗等关键工艺提供了稳定高效的等离子环境。
The MKS AX7700MTS-03 plasma source is a radio frequency plasma power supply from the Paragon F series under MKS (ASTRON). It adopts a remote plasma source (RPS) design, and the plasma is generated in an independent chamber far away from the process chamber and transported to the wafer surface, which can effectively avoid electrode contamination and metal sputtering, providing a high stability, high ionization efficiency, and low pollution plasma environment for key processes in the semiconductor and pan semiconductor industries.
1、 Product application areas (10 items)
Semiconductor etching process (dielectric etching, conductor etching)
Semiconductor Chemical Vapor Deposition (CVD)
Semiconductor Physical Vapor Deposition (PVD)
Semiconductor ion implantation process
Dry cleaning of semiconductor wafers
Photoresist removal (photoresist removal process)
Wafer surface activation treatment
Photovoltaic panel manufacturing (PECVD and other processes)
Flat Panel Display (FPD) Panel Manufacturing
LED chip manufacturing
2、 Core product parameters (5 items)
Product Series: MKS ASTRON Paragon F Series Remote Plasma Source (RPS)
Rated power: 7000 W
Operating frequency: 13.56 MHz ± 0.05%
Ionization efficiency: ≥ 95%
Cooling method: Water cooling
Conclusion: In summary, MKS AX7700MTS-03 (Paragon F series RPS remote plasma source), as a mainstream model in dry process technology in the semiconductor and pan semiconductor industries, provides a stable and efficient plasma environment for key processes such as etching, deposition, and cleaning with its 7kW high-power RF output, high ionization efficiency of ≥ 95%, and remote plasma design.

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