MKS AX7670-19 远程等离子体源 PDF资料
1.产 品 资 料 介 绍：
MKS AX7670-19 是 MKS Instruments 旗下 ASTRONi 系列的一款远程等离子体源，专为半导体制造中的反应气体活化与腔室清洁工艺设计，广泛应用于 CVD、FPD 等制程设备中。
产品特点
采用专利低场环形等离子体技术，气体解离率高。
无需氩气即可完成反应气体活化，降低用气成本。
额定 NF₃ 流量达 3.0 slm，支持高效清洁工艺。
原子氟产生效率高，适用于 CVD 腔室内部沉积物清洁。
支持连续运行模式，不受占空比限制，适配大型腔室。
集成电源、控制模块与等离子体室于一体，结构紧凑。
采用盖子安装设计，安装便捷，易于集成至各类设备。
兼容 200mm 和 300mm 晶圆制程设备。
通过 CE 认证，符合 SEMI S2 安全标准。
适用于 AMAT 等主流半导体设备的配套与替换。
产品参数
型号：AX7670-19 / ASTRONi。
额定 NF₃ 流量：3.0 slm。
输入电源：3-phase, 200-208VAC, 50/60Hz。
工作压力范围：1-10 Torr。
冷却方式：水冷，流量 1.5 gpm。
综上所述，MKS AX7670-19 凭借其高效的等离子体解离能力、无需氩气运行和紧凑的集成设计，能够为半导体 CVD 及 FPD 等工艺中的腔室清洁与反应气体活化提供可靠、经济的解决方案。
MKS AX7670-19 is a remote plasma source from the ASTRONI series under MKS Instruments, designed specifically for reactive gas activation and chamber cleaning processes in semiconductor manufacturing. It is widely used in CVD, FPD and other process equipment.
Product Features
Using patented low field annular plasma technology, the gas dissociation rate is high.
No argon gas is required to activate the reaction gas, reducing gas costs.
Rated NF ∝ flow rate of 3.0 slm, supporting efficient cleaning processes.
Atomic fluorine has high production efficiency and is suitable for cleaning deposits inside CVD chambers.
Support continuous operation mode, not limited by duty cycle, suitable for large chambers.
Integrated power supply, control module, and plasma chamber, with a compact structure.
Adopting a cover installation design, it is easy to install and integrate into various devices.
Compatible with 200mm and 300mm wafer processing equipment.
Passed CE certification and meets SEMI S2 safety standards.
Suitable for matching and replacing mainstream semiconductor equipment such as AMAT.
Product Parameters
Model: AX7670-19/ASTRONI.
Rated NF ∝ flow rate: 3.0 slm.
Input power supply: 3-phase, 200-208VAC, 50/60Hz.
Working pressure range: 1-10 Torr.
Cooling method: Water cooling, flow rate of 1.5 gpm.
In summary, MKS AX7670-19, with its efficient plasma dissociation capability, argon free operation, and compact integrated design, can provide a reliable and economical solution for chamber cleaning and reactive gas activation in semiconductor CVD and FPD processes.
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