SHINKO H3-0856 C6C0856 印刷电路板 PDF资料
1.产 品 资 料 介 绍:
SHINKO H3-0856 C6C0856 印刷电路板 产品简介
SHINKO H3-0856 C6C0856 是新光电气工业(Shinko Electric Industries)推出的一款高密度多层印刷电路板,主要用于半导体封装、移动设备模块及工业控制系统等领域。
产品参数
产品型号:SHINKO H3-0856 C6C0856
制造商:新光电气工业(SHINKO ELECTRIC)
产品类型:高密度多层印刷电路板
适用领域:半导体封装、移动设备模块、工业控制
质保期:365天
产品特点
采用积层法多层结构,支持高密度布线
适合多芯片组件及系统级封装
支持激光微孔技术,实现精细线路
薄型化设计,适用于紧凑设备
良好电气性能,适合高频高速信号传输
支持多种表面处理工艺
高可靠性材料,长期运行稳定
散热性能良好
支持多层数结构选择
原厂品质,性能可靠
结语
SHINKO H3-0856 C6C0856 作为新光电气工业的高密度积层板,凭借其精细线路加工能力、薄型化设计及良好的电气特性,为半导体封装及移动设备等领域的紧凑型电路设计提供可靠的载体解决方案。
SHINKO H3-0856 C6C0856 印刷电路板 英文介绍
SHINKO H3-0856 C6C0856 Printed Circuit Board Product Introduction
SHINKO H3-0856 C6C0856 is a high-density multi-layer printed circuit board launched by Shinko Electric Industries, mainly used in semiconductor packaging, mobile device modules, and industrial control systems.
Product Parameters
Product model: SHINKO H3-0856 C6C0856
Manufacturer: SHINKO ELECTRIC
Product type: High density multi-layer printed circuit board
Applicable fields: semiconductor packaging, mobile device modules, industrial control
Warranty period: 365 days
Product Features
Adopting a multi-layer structure using the layering method, supporting high-density wiring
Suitable for multi chip components and system level packaging
Support laser micro hole technology to achieve precise circuits
Thin design, suitable for compact devices
Good electrical performance, suitable for high-frequency and high-speed signal transmission
Support multiple surface treatment processes
High reliability materials, stable long-term operation
Good heat dissipation performance
Support multi-layer structure selection
Original factory quality, reliable performance
Conclusion
SHINKO H3-0856 C6C0856, as a high-density multilayer board for Shin Kong Electric Industry, provides a reliable carrier solution for compact circuit design in semiconductor packaging and mobile devices due to its fine circuit processing capability, thin design, and good electrical characteristics.
SHINKO H3-0856 C6C0856 印刷电路板 产品图片

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