Huttinger  935416-16背板接口PCB PDF资料 

1.产 品 资 料 介 绍：

Huttinger 935416-16 背板接口 PCB

产品概述

Huttinger 935416-16 是一款 工业级背板接口 PCB（Backplane Interface PCB），用于射频发电机、功率模块及等离子控制系统中实现模块间通信和电源/信号分配。该背板 PCB 提供高可靠性的信号和电源连接，是工业等离子及射频设备中不可或缺的基础组件。

• 型号：935416-16

• 类型：背板接口 PCB（Backplane Interface PCB）

• 功能：模块间信号传输、功率分配、系统互联

• 应用领域：半导体制造、薄膜沉积、等离子工艺、科研实验

产品特点

1. 高可靠信号连接

• 提供稳定的模块间信号接口，确保射频或直流模块之间通信无干扰。

2. 电源分配功能

• 能够为各控制模块、功率模块提供稳定电源分配，保障系统正常运行。

3. 工业级设计

• 高可靠性 PCB 材料，耐高温、抗振动和电磁干扰能力强，适合长期连续运行。

4. 模块化结构

• 可与多种 HUTTINGER 系列模块配套使用，方便系统扩展和升级。

5. 安全与保护

• 内置信号与电源保护设计，降低模块损坏风险，提高整体系统稳定性。

应用领域

1. 半导体制造

• 用于等离子刻蚀、溅射沉积等工艺设备的模块间信号及电源连接。

2. 薄膜沉积与表面处理

• 在 PVD/CVD 或工业涂层系统中，实现功率和信号模块的可靠互联。

3. 科研实验

• 材料科学、等离子物理实验设备中，作为核心模块互联桥梁。

4. 工业制造

• 精密表面处理及功能性薄膜加工设备的内部控制与电源分配。

英文资料：

Huttinger 935416-16 Backplane Interface PCB

Product Overview

Huttinger 935416-16 is an industrial grade Backplane Interface PCB used for inter module communication and power/signal distribution in RF generators, power modules, and plasma control systems. This backplane PCB provides high reliability signal and power connections and is an essential foundational component in industrial plasma and RF equipment.

Model: 935416-16

Type: Backplane Interface PCB

Function: Signal transmission between modules, power distribution, system interconnection

Application areas: semiconductor manufacturing, thin film deposition, plasma technology, scientific research experiments

Product Features

High reliability signal connection

Provide stable signal interfaces between modules to ensure interference free communication between RF or DC modules.

Power distribution function

Capable of providing stable power distribution for various control modules and power modules, ensuring the normal operation of the system.

Industrial-grade design

High reliability PCB material with strong resistance to high temperature, vibration, and electromagnetic interference, suitable for long-term continuous operation.

Modular structure

It can be used in conjunction with various HUTTINGER series modules for easy system expansion and upgrade.

Security and protection

Built in signal and power protection design reduces the risk of module damage and improves overall system stability.

Application field

Semiconductor Manufacturing

Used for inter module signal and power connection of process equipment such as plasma etching and sputtering deposition.

Thin film deposition and surface treatment

Reliable interconnection of power and signal modules in PVD/CVD or industrial coating systems.

Scientific research experiment

As a core module interconnection bridge in materials science and plasma physics experimental equipment.

industrial manufacturing

Internal control and power distribution of precision surface treatment and functional film processing equipment.

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