NESLAB 620000000015 换热器 PDF资料
1.产 品 资 料 介 绍：
NESLAB 620000000015 是一款用于半导体工艺设备的热流体循环换热器，主要承担工艺环节的恒温与冷却任务。
产品特点：
温控范围 +30°C 至 85°C，配 6 kW 加热器，满足恒温与升温需求。
4 个冷却通道，每通道 2 GPM，可同时冷却多个负载点。
冷却能力 8 kW @ 5 GPM，泵流量 30 LPM、压力 5.5 bar，输送稳定。
内置去离子包与 20 微米过滤器，保持冷却介质纯净。
符合 CE 与 IBM 安全标准，带 EMO 急停和通信接口，便于联动监控。
产品应用领域：
干法刻蚀腔体与电极冷却。
湿法刻蚀槽体温度控制。
CVD、PVD 等干法沉积设备散热。
电化学镀等湿法沉积工艺温控。
离子注入机整机热管理。
等离子灰化设备冷却。
CMP 平坦化设备部件冷却。
射频电源高功率模块散热。
腔壁、电极、卡盘等关键部件温控。
臭氧发生器、清洗槽、电镀槽等辅助设备温控。
结尾： 总体来看，该换热器以多通道、大冷量和去离子水兼容为特点，适用于刻蚀、沉积、注入、平坦化等半导体前道工序的热管理，是保障工艺稳定与设备可靠运行的辅助单元
2.英文详情介绍
NESLAB 62000000015 is a hot fluid circulation heat exchanger used in semiconductor process equipment, mainly responsible for constant temperature and cooling tasks in the process.
Product Features:
Temperature control range+30 ° C to 85 ° C, equipped with a 6 kW heater to meet the requirements of constant temperature and temperature rise.
Four cooling channels, each with 2 GPM, can simultaneously cool multiple load points.
Cooling capacity of 8 kW @ 5 GPM, pump flow rate of 30 LPM, pressure of 5.5 bar, stable delivery.
Built in deionization bag and 20 micron filter to maintain the purity of the cooling medium.
Compliant with CE and IBM safety standards, equipped with EMO emergency stop and communication interfaces for easy linkage monitoring.
Product application areas:
Dry etching chamber and electrode cooling.
Temperature control of wet etching tank body.
Heat dissipation of dry deposition equipment such as CVD and PVD.
Temperature control for wet deposition processes such as electrochemical plating.
Thermal management of ion implantation machine.
Cooling of plasma ashing equipment.
Cooling of CMP planarization equipment components.
High power module heat dissipation for RF power supply.
Temperature control of key components such as cavity walls, electrodes, and chucks.
Temperature control of auxiliary equipment such as ozone generators, cleaning tanks, and electroplating tanks.
Conclusion: Overall, this heat exchanger is characterized by multiple channels, high cooling capacity, and compatibility with deionized water. It is suitable for thermal management of semiconductor front-end processes such as etching, deposition, injection, and planarization, and is an auxiliary unit to ensure process stability and reliable equipment operation
3.产品图片
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| AMAT 0190-05887 | AMAT 0190-37771 | AMAT 0190-13915 |
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