Gasonics A95-056-01 端点探测器  PDF资料 

1.产 品 资 料 介 绍：

产品概述

Gasonics A95-056-01 是一款用于半导体制造设备的端点探测器，主要用于监测等离子体处理或蚀刻过程中的工艺完成时刻。它通过分析等离子反应气体中的光学变化，判断清洗或蚀刻是否达到预设条件，以优化工艺控制精度。

技术参数（简要）

• 类型：光学端点检测器

• 作用原理：基于等离子体发射光谱变化

• 安装方式：集成在等离子体处理腔室中

• 应用设备：适用于 Gasonics Aura 系列等离子清洗设备

应用场景

1. 光刻胶去除（Plasma Ashing）
   在半导体晶圆制造过程中，用于识别光刻胶剥离是否完成，避免过度处理。

2. 干法蚀刻结束监控
   在硅片蚀刻中，探测器可监控等离子体反应产物变化，判断工艺是否达到设定深度或形貌。

3. 等离子清洗过程控制
   在晶圆清洗工艺中，精确判断清洗终点，减少设备污染与残留物。

4. Gasonics 等离子设备配套
   常用于 Aura 1000、Aura 2000、Aura 3010 等型号，作为原装或替代零部件。

英文资料：

product overview

Gasonics A95-056-01 is an endpoint detector used in semiconductor manufacturing equipment, primarily for monitoring the process completion time during plasma processing or etching. It analyzes the optical changes in the plasma reaction gas to determine whether the cleaning or etching has reached the preset conditions, in order to optimize the process control accuracy.

Technical parameters (brief)

Type: Optical Endpoint Detector

Working principle: Based on changes in plasma emission spectra

Installation method: Integrated into the plasma processing chamber

Application equipment: Suitable for Gasonics Aura series plasma cleaning equipment

Application scenarios

Photoresist removal (Plasma Ashing)

In the semiconductor wafer manufacturing process, it is used to identify whether the photoresist stripping is completed and avoid excessive processing.

Dry etching end monitoring

In silicon wafer etching, detectors can monitor changes in plasma reaction products to determine whether the process has reached the set depth or morphology.

Plasma cleaning process control

In the wafer cleaning process, accurately determining the cleaning endpoint reduces equipment contamination and residue.

Gasonics plasma equipment matching

Commonly used in Aura 1000, Aura 2000, Aura 3010 and other models as original or replacement parts.

2.产      品      展      示      

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