HIEE300831R0001 UAC346AE01模块备件,DCS工控模块备件
16.21.5.1载体安装要求100值不包括已安装I/O模块的功耗。计算总功率需求时，根据I/O模块数据表添加I/O模块的功耗。PACSystems*RX3i系统手册第16节GFK-2314T 2019年9月专用模块792 CEP001载体和可选扩展载体CEE001可安装在DIN导轨或面板上。需要足够的安装空间：1。通信端口电缆间隙。2.电源接线。3.操作DIN闩锁。连接有I/O模块的RX3i CEP001载体需要最小深度为165 mm的外壳。额定热规格基于设备上方和下方的间隙为5.1 cm（2”），RX3i CEP001载体左侧的间隙为2.54 cm（1”）。图409：安装图CEP001和CEE001 16.21.5.2将CEE001扩展托架连接到CEP001托架图410：将CEE0001连接到CEP0011。打开RX3i CEP001托架上的连接器盖。2.沿RX3i CEP001托架上的导槽滑动并安装RX3i CEE001扩展托架。3.当扩展托架与CEP001托架对齐时，接合扩展连接器。4.关闭连接器盖。PACSystems*RX3i系统手册第16节GFK-2314T 2019年9月专用模块793 5。将扩展托架固定到DIN导轨或面板上。请参阅在DIN导轨或面板安装上安装RX3i CEP001托架。6.将CEE001上的接地孔连接至面板或外壳，如下接地所述。PACSystems*RX3i系统手册第16节GFK-2314T 2019年9月专用模块794 16.21.5.3在DIN导轨上安装RX3i CEP001载体载体安装在标准EN 50022，35 x 7.5 mm DIN导轨上。正确接地需要导电（未涂漆）饰面。为了获得最佳的抗振动性，DIN导轨应使用间距约15 cm（6“）的螺钉水平安装在面板上。1.使用小平头螺丝刀，拉出两个DIN导轨闩锁，并将托架放在DIN导轨上。2.推入两个DIN导轨闩锁，使闩锁固定DIN导轨。16.21.5.4面板安装对于需要最大或长期抵抗机械振动和冲击的应用，强烈建议采用面板安装方法。要求最小面板厚度为2.4 mm（.093“）。安装图（下图412）适用于CEP001载体和CEE001扩展载体。注1：所有尺寸的公差均为±0.2 mm（0.078“）非累积公差。注2：对拧入面板螺纹孔的M3.5（#6-32）钢螺钉施加1.1至1.4 Nm（10至12 in/lbs）的扭矩。图411：DIN导轨安装顺序PACSystems*RX3i系统手册第16节GFK-2314T 2019年9月专用模块795图412：面板安装图：CEP001或CEE001 16.21.5接地警告系统中的所有CEP001载体必须接地，以将电击危险降至最低。否则可能导致严重的人身伤害。RX3i CEP001载体和CEE001扩展载体各提供两个接地连接触点：·载体背面的接地夹，需要DIN导轨安装·载体左下方的接地螺钉孔注：当载体安装在DIN导轨上时，载体背面的连接夹不能提供充分的接地连接。承运人的金属背部也必须使用单独的导体接地。使用带环形端子的最小AWG#12（3.3 mm2）导线将每个托架接地至面板或外壳。使用M3螺钉、星形锁紧垫圈和平垫圈将电线连接到载体的接地孔。使用机器螺钉、星形锁紧垫圈和平垫圈将接地线的另一端连接到接地安装面板或外壳的螺纹孔。或者，如果面板有接地螺柱，则为接地螺上的每根导线使用螺母和星形锁紧垫圈，以确保充分接地。当连接到涂漆面板时，应清除油漆，使其干净，裸露金属暴露在连接点。
16.21.5.1 Carrier Installation Requirements 100 Value does not include the power consumption of the installed I/O modules. When calculating the total power requirements, add the power consumption of the I/O modules according to the I/O module datasheet. PACSystems* RX3i System Manual Section 16 GFK-2314T Sept. 2019 Special Purpose Modules 792 The CEP001 Carrier and optional Expansion Carrier CEE001 can be mounted on a DIN-rail or on a panel. Adequate installation space is required for: 1. Clearance for communications port cables. 2. Power wiring. 3. Operating the DIN latch. The RX3i CEP001 Carrier with an I/O module attached requires an enclosure with minimum depth of 165 mm. Rated thermal specifications are based on a clearance of 5.1 cm (2”) above and below the equipment and 2.54 cm (1”) to the left of the RX3i CEP001 Carrier. Figure 409: Mounting Diagram CEP001 & CEE001 16.21.5.2 Connecting the CEE001 Expansion Carrier to the CEP001 Carrier Figure 410: Attaching CEE001 to CEP001 1. Open the connector cap on the RX3i CEP001 Carrier. 2. Slide and install the RX3i CEE001 Expansion Carrier along the guide slots on the RX3i CEP001 Carrier. 3. When the Expansion Carrier is aligned with the CEP001 Carrier, engage the expansion connectors. 4. Close the connector cap. PACSystems* RX3i System Manual Section 16 GFK-2314T Sept. 2019 Special Purpose Modules 793 5. Secure the Expansion Carrier to the DIN rail or panel. Refer to Installing an RX3i CEP001 Carrier on a DIN-rail or Panel Mounting. 6. Connect the grounding hole on the CEE001 to the panel or enclosure as described in Grounding below. PACSystems* RX3i System Manual Section 16 GFK-2314T Sept. 2019 Special Purpose Modules 794 16.21.5.3 Installing an RX3i CEP001 Carrier on a DIN-rail The carrier mounts on a standard EN 50022, 35 x 7.5 mm DIN-rail. Conductive (unpainted) finish is required for proper grounding. For best resistance to vibration, the DIN-rail should be installed horizontally on a panel using screws spaced approximately 15 cm (6”) apart. 1. With a small flathead screwdriver, pull out the two DIN-rail latches and stand the carrier on the DIN-rail. 2. Push in the two DIN-rail latches so that the latches hold the DIN-rail. 16.21.5.4 Panel Mounting For applications requiring maximum or long-term resistance to mechanical vibration and shock, the panel-mounting method is strongly recommended. A minimum panel thickness of 2.4 mm (.093”) is required. The mounting diagram (Figure 412 below) applies to both the CEP001 Carrier and CEE001 Expansion Carrier. Note 1: Tolerances on all dimensions are ±0.2 mm (0.078”) non-cumulative. Note 2: Apply 1.1 to1.4 Nm (10 to12 in/lbs) of torque to M3.5 (#6-32) steel screws threaded into tapped holes in the panel. Figure 411: DIN Rail Mounting Sequence PACSystems* RX3i System Manual Section 16 GFK-2314T Sept. 2019 Special Purpose Modules 795 Figure 412: Panel Mounting Diagram: CEP001 or CEE001 16.21.5.5 Grounding WARNING All CEP001 Carriers in a system must be grounded to minimize electrical shock hazard. Failure to do so can result in severe personal injury. The RX3i CEP001 Carrier and CEE001 Expansion Carrier each provide two grounding connection contacts: · Grounding clips at the back of the carrier, which require DIN-rail installation · Grounding screw hole at bottom-left of the carrier Note: When the Carrier is mounted on a DIN-rail, the grounding clips on the back of the Carrier do not provide an adequate ground connection. The Carrier’s metal back must also be grounded using a separate conductor. Ground each Carrier to the panel or enclosure using a minimum AWG #12 (3.3 mm2 ) wire with ring terminals. Use an M3 screw, star lock washer and a flat washer to connect the wire at the Carrier’s grounding hole. Connect the other end of the ground wire to a tapped hole in the grounded mounting panel or enclosure, using a machine screw, star lock washer and flat washer. Alternately, if the panel has a ground stud, use a nut and star lock washer for each wire on the ground stud to ensure adequate grounding. Where connections are made to a painted panel, the paint should be removed so clean, bare metal is exposed at the connection point.
