IS200ISBBG1AAB IS200ISBBG1机器人卡件
I/O模块Comm Bus 2 Mbaud通信模块42第2章Tricon v9–v10系统3006和3007主处理器体系结构的系统组件规划和安装指南此图描述了可用于Tricon v9.0-v9.5系统的3006和300k型主处理器体系。除了SRAM（3006为2兆字节，3007为1兆字节）之外，它们具有相同的架构和规格。图16 3006和3007主处理器架构串行端口用于诊断分析一个25针连接器上的光学隔离RS-232接口500 VDC隔离通信处理器Motorola MPC860，50 MHz，32位通信接口协议波特率RS-485 2兆位/秒I/O接口协议波特率逻辑功率RS-485 375千位/秒10 W表8 3008主处理器规格功能描述故障检测电路定时发生器中断控制器主处理器NS32GX32调试通信端口DMA双端口RAM双端口RAM TRIBUS状态指示灯双电源稳压器+5VDC上行流下行流容错通信总线容错I/O总线IOC处理器内部系统总线双电源导轨512 KB EPROM 2 MB SRAM*IOP处理器上行流下行浮点处理器NS32381主处理器模块43 Tricon v9–v10系统3006和3007规格规划和安装指南本表列出了规格用于3006和3007主处理器，可用于Tricon v9.0-v9.5系统。表9 3006和3007主处理器规格功能规格中央处理器国家NS32GX32，32位，25 MHz数学协处理器国家NS32381，32位、25 MHz EPROM存储器512KB SRAM型号3006：2 MB型号3007：1 MB时钟日历时间和日期电池备份典型漂移：±2秒/天最大漂移：±8.6秒/天TriBus 4兆位/秒，16位DMA串行端口用于诊断分析一个25针连接器上的光学隔离RS-232接口500 VDC隔离通信处理器Intel 80C152 32 KB EPROM，64K共享内存接口16 MHz通信接口协议波特率RS-485每秒2兆位I/O处理器Intel 80C31 12 MHz 32 KB EPROM 64K共享存储器接口I/O接口协议波特率RS485每秒375千位逻辑功率15 W 44第2章Tricon v9–v10系统组件规划和安装指南主处理器诊断扩展诊断程序验证每个主处理器以及每个I/O模块和通信通道的运行状况。瞬态故障由硬件多数表决电路记录和屏蔽。诊断持续性故障，并热更换或以容错方式操作错误模块，直到完成热更换。主处理器诊断包括以下功能：•验证固定程序内存•验证RAM的静态部分•测试所有基本处理器指令和操作模式•测试所有浮点处理器指令•验证与I/O处理器的共享内存接口•验证每个I/O处理器、通信处理器、本地内存、共享内存访问、，和RS-485收发器的环回•验证TriClock接口•验证每个MP底部的Tribus接口A标准、25针、公D连接器（RS-232）以每秒9600位的速度运行，Triconex代表可用于诊断分析。RS-232端口完全隔离（最大500 VDC），以提供接地故障保护。RXM和SRXM模块45 Tricon v9–v10系统的规划和安装指南RXM和SRCM模块本节介绍RXM和RXM模块，这些模块在RXM机箱中用于扩展主机箱的I/O通信。多模电缆用于距离主底盘1.2英里（2公里）的位置；单模电缆用于远达7.5英里（12公里）的位置。RXM和SRXM模块以每秒375千比特的速度通信。这些模块提供优异的抗静电和电磁干扰能力，并使用光纤调制解调器和光纤点对点布线。有关安装信息，请参阅第203页的RXM机箱安装。RXM模块RXM模块（型号4200-3和4201-3）经过优化，可用于62.5/125微米多模光纤。
I/O Modules Comm Bus 2 Mbaud Communication Modules 42 Chapter 2 System Components Planning and Installation Guide for Tricon v9–v10 Systems 3006 and 3007 Main Processor Architecture This figure depicts the model 3006 and 3007 Main Processor architecture, which can be used with Tricon v9.0—v9.5 systems. They have the same architecture and specifications, except for SRAM, which is 2 megabytes for the 3006 and 1 megabyte for the 3007. Figure 16 3006 and 3007 Main Processor Architecture Serial port For diagread diagnostic analysis Optically isolated RS-232 interface on one 25-pin connector 500 VDC isolation Communication processor Motorola MPC860, 50 MHz, 32-bit Communication interface Protocol Baud rate RS-485 2 megabits per second I/O interface Protocol Baud Rate Logic power RS-485 375 kilobits per second 10 W Table 8 3008 Main Processor Specifications Feature Description Failure Detect Circuitry Timing Generator Interrupt Controller Main Processor NS32GX32 Debug Comm Port DMA Dual Port RAM Dual Port RAM TRIBUS Status Indicators Dual Power Regulators +5VDC Up Stream Down Stream Fault-Tolerant Communication Bus Fault-Tolerant I/O Bus IOC Processor Internal System Bus Dual Power Rails 512 Kbytes EPROM 2 Mbytes SRAM* IOP Processor Up Stream Down Stream Floating Point Processor NS32381 Main Processor Modules 43 Planning and Installation Guide for Tricon v9–v10 Systems 3006 and 3007 Specifications This table lists the specifications for the 3006 and 3007 Main Processors, which can be used with Tricon v9.0—v9.5 systems. Table 9 3006 and 3007 Main Processor Specifications Feature Specification Central processor National NS32GX32, 32 bits, 25 MHz Math co-processor National NS32381, 32 bits, 25 MHz EPROM memory 512KB SRAM Model 3006: 2 MB Model 3007: 1 MB Clock calendar Time and date Battery backup Typical drift: ±2 seconds per day Maximum drift: ±8.6 seconds per day TriBus 4 megabits per second, 16-bit DMA Serial port For Diagread diagnostic analysis Optically isolated RS-232 interface on one 25-pin connector 500 VDC isolation Communication processor Intel 80C152 32 KB EPROM, 64K shared memory interface 16 MHz Communication Interface Protocol Baud rate RS-485 2 megabits per second I/O processor Intel 80C31 12 MHz 32 KB EPROM 64K Shared Memory Interface I/O interface Protocol Baud Rate RS-485 375 kilobits per second Logic power 15 W 44 Chapter 2 System Components Planning and Installation Guide for Tricon v9–v10 Systems Diagnostics for Main Processors Extensive diagnostics validate the health of each Main Processor as well as each I/O module and communication channel. Transient faults are recorded and masked by the hardware majority-voting circuit. Persistent faults are diagnosed, and the errant module is hot-replaced or operated in a fault-tolerant manner until hot replacement is completed. Main Processor diagnostics include these features: • Verify fixed-program memory • Verify the static portion of RAM • Test all basic processor instructions and operating modes • Test all basic floating-point processor instructions • Verify the shared memory interface with I/O processors • Verify each I/0 processor, communication processor, local memory, shared memory access, and loopback of RS-485 transceivers • Verify the TriClock interface • Verify the Tribus interface A standard, 25-pin, male D-connector (RS-232) at the bottom of each MP operates at 9600 bits per second and can be used by Triconex representatives for diagnostic analysis. The RS-232 port is fully isolated (500 VDC, maximum) to provide protection against ground faults. RXM and SRXM Modules 45 Planning and Installation Guide for Tricon v9–v10 Systems RXM and SRXM Modules This section describes RXM and SRXM Modules, which are used in RXM Chassis to extend the I/O communication from the Main Chassis. Multi-mode cable is used for locations as far as 1.2 miles (2 kilometers) from the Main Chassis; single-mode cable is used for locations as far as 7.5 miles (12 kilometers). RXM and SRXM Modules communicate at 375 kilobits per second. The modules provide exceptional immunity against electro-static and electro-magnetic interference and use optical modems and fiber-optic point-to-point cabling. For installation information, see RXM Chassis Installation on page 203. RXM Modules RXM Modules (model 4200-3 and 4201-3) are optimized for use with 62.5/125 micrometer multi-mode fiber.
