VMIVME-7648-740工控模块机器人备件
还应注意随着温度
增加约:因此必须允许一些保护带应用曲线图与开（仅限）图 关（仅限 ）电源建议和设计为在 至 的输入电源电压范围内工作输入电源必须调节良好无杂散噪声为确保或输出电压得到良好调节输入电源必须至少为 或 以较高者为准要求引脚 范围内的最小计算器值为μ布局 布局和设备的动态性能取决于的布局布局实践对于典型来说是足够的可能会降低或的负载调节噪声或瞬态性能通过将和放置在与或者相同的侧并且尽可能接近包装和的接地连接必须返回到或 引脚使用尽可能宽和短的铜迹线必须避免使用长迹线长度窄迹线宽度或通孔连接这些附加的电感和电阻会导致较差的性能特别是在瞬态条件下强烈建议在两层的相对侧或嵌入多层中的接地平面该接地
平面用于两个目的：
提供电路参考平面以确保准确性以及提供热平面以通过封装下的热通孔从或 封装移除热量 电源接地 热 / 电源接地 热 电源地 电源地线文件夹链接： 版权所有©–德克萨斯仪器公司提交文件反馈布局示例图 软件包图 软件包图 软件包图 封装 安装（无回拉）引线封装需要特定的安装技术详细信息见应用报告无引线引线框架封装参考节“设计建议”（第页）应注意的是应与封装一起使用的样式是（非焊料掩模定义）类型此外建议端子比包装长以形成焊料圆角以提高可靠性和检查输入电流在两个引脚和之间分流两个插脚必须连接在一起以确保设备在额定电流下满足所有规格封装的热分解与印刷电路板结构和连接到的额外铜面积的数量直接相关封装底部的（暴露）
It should also be noted that
Increase by about: Therefore, some protective tapes must be allowed to apply the curve graph and the on (only) graph. The power supply is recommended and designed to work within the input power voltage range of to. The input power supply must be well adjusted without stray noise to ensure or the output voltage is well adjusted. The input power supply must be at least or the higher one. The minimum calculator value within the pin range is μ The layout layout and the dynamic performance of the equipment depend on the layout layout practice, which is typical enough, and may reduce the load regulation noise or transient performance of or. By placing and on the same side as or and as close to the package and as possible, the grounding connection must be returned to or pins. Use copper traces as wide and short as possible. Avoid using long trace lines, narrow trace lines, or through hole connections. These additional inductors and resistors will conduct Poor performance, especially under transient conditions, it is strongly recommended that the grounding be conducted on the opposite side of two layers or on the grounding plane embedded in multiple layers
The plane is used for two purposes:
Provide a circuit reference plane to ensure accuracy and a thermal plane to remove thermal power from or from the package through the thermal vias under the package Geothermal/Power Ground Geothermal Power Ground Wire Folder Link: Copyright ©– Texas Instruments submitted a file feedback layout example diagram software package diagram software package diagram package installation (no pullback) lead packaging needs specific installation technology details see the application report No lead lead frame packaging reference section "Design recommendations" (page) It should be noted that the style that should be used with packaging is (non solder mask definition) Type In addition, it is recommended that the terminal be longer than the package to form a solder fillet to improve reliability and check that the input current is shunted between two pins. The two pins must be connected together to ensure that the equipment meets the thermal decomposition of all specifications of packages at rated current. The PCB structure and the number of additional copper areas connected to it are directly related to the (exposed)
