Woodwaard 9907-1183工控机器人备件
计算值仅供参考
并非作为规范提供。发布前鉴定测试请阅读LED可靠性概述，了解Cree为确保XLamp LED长期可靠性而采用的鉴定流程的详细信息，以及Cree为XLamp LED进行的发布前鉴定试验的详细信息。Lumen Maintenance Cree现在使用标准化的IES LM-80-08和TM-21-11方法来收集长期数据和外推LED流明维护。有关此LED可用的特定LM-80数据集的信息，请参阅公开的LM-80结果文档。请阅读长期管腔维护应用说明，了解Cree管腔维护测试和预测的更多详情。有关热设计、环境温度和驱动电流如何影响LED结温度的详细信息，请阅读热管理应用说明。湿度敏感性Cree建议将XLamp MX-3S LED保持在提供的、可重新密封的防潮包装（MBP）中，直到焊接前。
湿度敏感性存储
含有XLamp LED的未打开MBP不需要特殊的湿度敏感性存储。一旦MBP打开，XLamp MX-3S LED应按照JEDEC J-STD-033的要求作为MSL 2a进行处理和存储，这意味着在焊接操作期间LED可能损坏之前，它们的暴露时间有限。右侧的表格根据温度和湿度条件规定了最大暴露时间（以天为单位）。曝光时间长于规定m的LED最大值必须根据下面列出的烘焙条件进行烘焙。烘烤条件无需烘烤所有XLamp MX-3S LED。只有符合以下所有标准的LED才能进行烘焙：1.从原始MBP中移除的LED。2.暴露在潮湿环境中的时间超过上述湿度敏感性部分所列时间的LED。3.未焊接的LED。LED应在70ºC下烘烤24小时。LED可以在原始卷轴上烘烤。烘烤前，从MBP上取下LED。不要在高于70ºC的温度下烘烤零件。
The calculated value is for reference only
Not provided as a specification. Please read the LED reliability overview for pre release qualification test to learn the details of the qualification process Cree has adopted to ensure the long-term reliability of XLamp LED, and the details of the pre release qualification test Cree has conducted for XLamp LED. Lumen Maintenance Cree now uses standardized IES LM-80-08 and TM-21-11 methods to collect long-term data and extrapolate LED lumen maintenance. For information about the specific LM-80 datasets available for this LED, see the published LM-80 results document. Please read the application instructions for long-term lumen maintenance to learn more about Cree lumen maintenance testing and prediction. For more information on how the thermal design, ambient temperature, and drive current affect the LED junction temperature, read the thermal management application instructions. Moisture Sensitive Cree recommends keeping the XLamp MX-3S LED in the moisture resistant resealable packaging (MBP) provided until welding.
Humidity sensitive storage
Unopened MBPs with XLamp LEDs do not require special humidity sensitive storage. Once the MBP is turned on, XLamp MX-3S LEDs should be handled and stored as MSL 2a according to JEDEC J-STD-033, which means that their exposure time is limited before LEDs may be damaged during welding operations. The table on the right specifies the maximum exposure time (in days) based on temperature and humidity conditions. The maximum LED exposure time longer than the specified m must be baked according to the baking conditions listed below. The baking conditions do not require baking all XLamp MX-3S LEDs. Only LEDs that meet all of the following criteria can be baked: 1. LEDs removed from the original MBP. 2. LEDs exposed to humid environment for more than the time listed in the humidity sensitive section above. 3. Unwelded LED. The LED shall be baked at 70 º C for 24 hours. LED can be baked on the original reel. Before baking, remove the LED from the MBP. Do not bake parts at temperatures higher than 70 º C.
