AMAT Applied Materials  0010-26057晶圆升降组件 PDF资料 

1.产 品 资 料 介 绍：

AMAT Applied Materials 0010-26057 晶圆升降组件 — 产品特点

1. 功能定位
   用于半导体设备中晶圆的升降与位置控制，实现晶圆在处理工序中的精确移动。

2. 结构设计
   模块化设计，采用高强度耐磨材料，保证长期稳定运行。

3. 驱动方式
   通常采用伺服电机或步进电机驱动，实现精确定位和可控升降速度。

4. 精度与重复性
   高精度机械结构，确保晶圆升降过程的重复定位精度。

5. 安装方式
   设计为易于安装和拆卸的模块，便于设备集成和维护。

6. 兼容性
   与多种 AMAT 半导体处理设备兼容，支持不同尺寸晶圆操作。

7. 安全保护
   内置限位装置、防撞结构，防止晶圆或组件损坏。

8. 维护便利
   模块化结构便于更换零件和进行定期维护，减少停机时间。

9. 性能稳定
   高品质材料和精密加工保证在高频运行下仍能稳定可靠工作。

10. 应用场景
    广泛应用于半导体制造设备的晶圆搬运、涂胶、刻蚀、清洗等工序。

总结：
AMAT 0010-26057 晶圆升降组件是半导体设备中关键的搬运模块，通过高精度机械结构和可靠驱动，实现晶圆在工序间的精确升降与定位，模块化设计便于安装和维护，保证设备运行稳定。

AMAT Applied Materials 0010-26057晶圆升降组件 英文介绍

AMAT Applied Materials 0010-26057 Wafer Lift Assembly - Product Features

functional positioning

Used for the lifting and position control of wafers in semiconductor equipment, achieving precise movement of wafers during processing.

structural design

Modular design, using high-strength wear-resistant materials to ensure long-term stable operation.

Drive Type

Usually driven by servo motors or stepper motors, precise positioning and controllable lifting speed are achieved.

Accuracy and repeatability

High precision mechanical structure ensures the repeated positioning accuracy of the wafer lifting process.

Installation method

Designed as a module that is easy to install and disassemble, facilitating equipment integration and maintenance.

compatibility

Compatible with various AMAT semiconductor processing equipment and supports wafer operations of different sizes.

safety protection

Built in limit device and anti-collision structure to prevent damage to wafers or components.

Convenient maintenance

The modular structure facilitates the replacement of parts and regular maintenance, reducing downtime.

stable performance

High quality materials and precision machining ensure stable and reliable operation even at high frequencies.

Application scenarios

Widely used in wafer handling, coating, etching, cleaning and other processes of semiconductor manufacturing equipment.

Summary:

AMAT 0010-26057 wafer lifting module is a key handling module in semiconductor equipment. Through high-precision mechanical structure and reliable driving, it achieves precise lifting and positioning of wafers between processes. The modular design is easy to install and maintain, ensuring stable equipment operation.

AMAT Applied Materials 0010-26057晶圆升降组件 产品展示      

3.其他产品

DS200SHVMG1AGE传感器装置
DS200SHVMG1AFE 数据采集模块
DS200RTBAG3AHC 数字量输入输出单元

4.其他英文产品

VMIVME5565 Gas turbine electric card
1756-ENBT/A Communication module
5SHY3545L0016 3BHB020720T0002 Thyristor module

本篇文章出自瑞昌明盛自动化设备有限公司官网，转载请附上此链接:http://www.jiangxidcs

品牌：AMAT Applied Materials

型号：0010-26057晶圆升降组件

质保：一年

成色：全新/二手

优势产品：ABB、GE、FOXBORO、TRICONEX、BENTLY、A-B、MOTOROLA、HONEYWELL 、SCHNEIDER 

                    WOODWARD、EMERSON、RELIANCE、DEIF、NI、XYVOM等

特点：主营产品各种模块/卡件，控制器，触摸屏，伺服驱动器。

应用行业：广泛应用于冶金、石油天然气、玻璃制造业、铝业、石油化工、煤矿、造纸印刷、纺织印染、机械、电子制造、汽车制造、烟草、塑胶机械、电力、水利、水处理/环保、市政工程、锅炉供暖、能源、输配电等

快递方式：国内顺丰、德邦、京东快递包邮，按照实际报价货期发货