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AMAT Applied Materials PAM-BKP3印刷电路板

AMAT Applied Materials PAM-BKP3印刷电路板

AMAT Applied Materials PAM-BKP3印刷电路板 PDF资料 1.产 品 资 料 介 绍:AMAT Applied Materials PAM-BKP3 印刷电路板一、产品概述AMAT PAM-BKP3 是应用材料公司(Applied Materials)专用的 工艺控制与系统通信印刷电路板,属于设备内部的 信号管理与备份控制单元(Process/Backup PCB As...

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AMAT Applied Materials PAM-BKP3印刷电路板

    AMAT Applied Materials PAM-BKP3印刷电路板 PDF资料 

    1.产 品 资 料 介 绍:

    AMAT Applied Materials PAM-BKP3 印刷电路板

    一、产品概述

    AMAT PAM-BKP3 是应用材料公司(Applied Materials)专用的 工艺控制与系统通信印刷电路板,属于设备内部的 信号管理与备份控制单元(Process/Backup PCB Assembly)
    该电路板通常安装于 AMAT 的 Centura、Endura、Producer、P5000 等真空工艺平台中,用于实现多通道输入输出、设备通信接口转换及系统逻辑控制等功能。

    它是 AMAT 控制系统中负责 信号处理、工艺状态反馈、设备协调与安全监控 的核心组件之一。


    二、产品特点

    1. 高集成度控制设计

      • 板上集成多种信号接口模块(模拟量、数字量、通信总线),实现多功能一体化控制。

      • 支持复杂的设备间信号逻辑交互,用于协调真空腔、传感器、驱动器和执行机构的协同运行。

    2. 稳定可靠的信号处理性能

      • 采用工业级高可靠性器件(如高速微处理器、隔离放大器、光耦模块等),确保信号采集与输出稳定。

      • 有效降低电磁干扰(EMI)与噪声影响,保证系统测控精度。

    3. 多层印刷电路板结构

      • 采用多层 PCB 设计(一般 6 层或以上),实现高速信号传输与良好接地屏蔽。

      • 优化的走线与电源分配结构可减少寄生电容与阻抗不匹配。

    4. 热管理与防护设计

      • 板体采用阻燃 FR-4 基材或高 TG 材料,适应真空设备内部温度变化。

      • 电源、信号线分区布局,具备过流保护与短路防护机制。

    5. 可热插拔与模块化结构

      • 支持模块化安装,方便维护和更换。

      • 提供标准化接插件接口,便于与系统主板或背板(Backplane)连接。

    6. 系统兼容性强

      • 与 AMAT 多代设备控制主板兼容,支持主控系统(如 LAM、RF、VAC 等)数据通信。

      • 可与控制器、电源模块、真空传感板等协同工作,构成完整的机台控制网络。

    7. 具备冗余与备份控制功能

      • 设计中包含冗余逻辑路径,当主控制链路发生故障时可自动切换,确保设备持续运行。

      • 常用于关键设备的安全互锁与紧急停机逻辑(E-Stop)控制。

    AMAT Applied Materials PAM-BKP3印刷电路板  英文介绍

    AMAT Applied Materials PAM-BKP3 Printed Circuit Board

    1、 Product Overview

    AMAT PAM-BKP3 is a process control and system communication printed circuit board specialized for Applied Materials, belonging to the internal signal management and backup control unit (Process/Backup PCB Assembly) of the equipment.

    This circuit board is usually installed in AMAT's vacuum process platforms such as Centura, Endura, Producer, P5000, etc., to achieve functions such as multi-channel input and output, device communication interface conversion, and system logic control.

    It is one of the core components responsible for signal processing, process status feedback, equipment coordination, and safety monitoring in the AMAT control system.

    2、 Product Features

    High integration control design

    Multiple signal interface modules (analog, digital, communication bus) are integrated on the board to achieve multifunctional integrated control.

    Support complex signal logic interaction between devices to coordinate the collaborative operation of vacuum chambers, sensors, drivers, and actuators.

    Stable and reliable signal processing performance

    Using industrial grade high reliability devices such as high-speed microprocessors, isolation amplifiers, optocoupler modules, etc., to ensure stable signal acquisition and output.

    Effectively reduce electromagnetic interference (EMI) and noise impact, ensuring system measurement and control accuracy.

    Multi layer printed circuit board structure

    Adopting multi-layer PCB design (usually 6 layers or more) to achieve high-speed signal transmission and good grounding shielding.

    Optimized wiring and power distribution structure can reduce parasitic capacitance and impedance mismatch.

    Thermal Management and Protection Design

    The board is made of flame-retardant FR-4 substrate or high TG material to adapt to temperature changes inside the vacuum equipment.

    Power and signal line partition layout, equipped with overcurrent protection and short-circuit protection mechanisms.

    Hot swappable and modular structure

    Support modular installation for easy maintenance and replacement.

    Provide standardized connector interfaces for easy connection to system motherboards or backplanes.

    High compatibility 

    Compatible with AMAT multi generation device control motherboards, supporting data communication for main control systems such as LAM, RF, VAC, etc.

    It can work together with controllers, power modules, vacuum sensing boards, etc. to form a complete machine control network.

    Equipped with redundancy and backup control functions

    The design includes redundant logical paths that can automatically switch when the main control link fails, ensuring the continuous operation of the equipment.

    Commonly used for safety interlock and emergency stop logic (E-Stop) control of critical equipment.

    AMAT Applied Materials PAM-BKP3印刷电路板 产品展示      

    applied_materials_amat_interlock_board_pam-bkp3.jpg

    3.其他产品

    Motorola MVME167-33B工业控制系统
    TRICONEX  3704E模拟输入模块
    REXROTH VT-VPCD-1-16/V0/1-P-1 R901089559放大器模块

    4.其他英文产品

    NI GPIB-140A/2 total line expander
    EATON MPB2-TP Connect the module
    SCHROFF MPS022 13100-203 module

    710-657068-208005-CP-50710-659603-20
    710-657058-208005-CP-51073-653015-00
    710-655651-208005-CB-60710-650099-20
    710-653699-208005-AN-108710-809156-000
    710-652697-208055-SCP-655X710-678525-00
    710-652010-208055-SCP-655R531X310SNDAEG1

    本篇文章出自瑞昌明盛自动化设备有限公司官网,转载请附上此链接:http://www.jiangxidcs

    品牌:AMAT Applied Materials


    型号:PAM-BKP3印刷电路板


    质保:一年


    成色:全新/二手


    优势产品ABB、GE、FOXBORO、TRICONEX、BENTLY、A-B、MOTOROLA、HONEYWELL 、SCHNEIDER 

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    特点:主营产品各种模块/卡件,控制器,触摸屏,伺服驱动器。


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    快递方式:国内顺丰、德邦、京东快递包邮,按照实际报价货期发货 

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