AMAT Applied Materials 0190-11570射频匹配器 PDF资料
1.产 品 资 料 介 绍：
产品概述
AMAT Applied Materials 0190-11570 射频匹配器（RF Matching Network）是应用于半导体工艺设备（如等离子体刻蚀、化学气相沉积等）的关键射频子系统。它的主要作用是将射频电源输出与等离子体负载之间进行阻抗匹配，从而最大化功率传输效率、减少反射功率，并保持等离子体稳定运行。该模块通常与 RF 电源配合使用，是 AMAT 机台工艺腔室的重要组成部分。
技术参数（常见特性，具体数值因版本不同可能有所差异）
工作频率：典型为 13.56 MHz 或多频 RF 系统（可能支持次级频率 2 MHz、27 MHz 等）。
功率范围：通常支持数百瓦至数千瓦的射频功率传输。
阻抗匹配范围：能够动态调节以匹配腔体负载阻抗（通常 50Ω 标准）。
控制方式：自动匹配（内置控制电路）或受外部主控系统控制。
接口：射频输入 / 输出同轴连接器，控制信号通过背板或独立接口传输。
冷却方式：部分型号可能采用风冷或水冷以保证长期稳定运行。
版本修订：0190-11570 可能存在不同修订（Rev A、Rev B 等），在电路参数、控制接口或功率等级上有所调整。
应用场景
等离子体刻蚀系统：为腔体等离子体提供稳定的射频功率，保持刻蚀速率和均匀性。
化学气相沉积（CVD）：确保沉积过程中的等离子体均匀性，提高薄膜质量。
离子注入和灰化工艺：在需要 RF 等离子体的工艺模块中，提供功率匹配以保证稳定放电。
AMAT 设备平台：专用于 Applied Materials 的特定机台系列，与其射频电源和腔室系统配套使用。
AMAT Applied Materials 0190-11570射频匹配器 英文介绍
Product Overview
The AMAT Applied Materials 0190-11570 RF Matching Network is a key RF subsystem used in semiconductor process equipment such as plasma etching, chemical vapor deposition, etc. Its main function is to match the impedance between the RF power output and the plasma load, thereby maximizing power transmission efficiency, reducing reflected power, and maintaining stable plasma operation. This module is usually used in conjunction with an RF power supply and is an important component of the AMAT machine process chamber.
Technical parameters (common characteristics, specific values may vary depending on version)
Operating frequency: Typically 13.56 MHz or multi frequency RF systems (may support secondary frequencies of 2 MHz, 27 MHz, etc.).
Power Range: Typically supports RF power transmission ranging from several hundred watts to several kilowatts.
Impedance matching range: It can be dynamically adjusted to match the impedance of the cavity load (usually 50 Ω standard).
Control mode: automatic matching (built-in control circuit) or controlled by an external main control system.
Interface: RF input/output coaxial connector, control signals are transmitted through a backplane or independent interface.
Cooling method: Some models may use air or water cooling to ensure long-term stable operation.
Version revision: 0190-11570 may have different revisions (Rev A, Rev B, etc.), with adjustments made to circuit parameters, control interfaces, or power levels.
Application scenarios
Plasma etching system: Provides stable RF power to the cavity plasma, maintaining etching rate and uniformity.
Chemical Vapor Deposition (CVD): Ensure plasma uniformity during the deposition process and improve film quality.
Ion implantation and ashing process: In process modules that require RF plasma, power matching is provided to ensure stable discharge.
AMAT equipment platform: a specific machine series designed for Applied Materials, used in conjunction with its RF power supply and chamber system.
AMAT Applied Materials 0190-11570射频匹配器 产品展示
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