AMAT Applied Materials 0100-02292背板 PDF资料
1.产 品 资 料 介 绍:
产品概述
AMAT Applied Materials 0100-02292 背板是一种应用于半导体设备的核心电路互联部件。它通常作为系统各功能模块之间的通信与电力分配通道,提供信号传输、供电与接口集成。背板在 AMAT 的工艺设备(如 CVD、PVD、刻蚀机等)中,用于实现控制系统与执行单元的稳定互联。
技术参数(典型特征,具体型号参数需结合实物/文档确认)
产品类型:电路背板(Backplane Assembly)
主要功能:
模块间的高速信号互联
电源分配与稳压
通道隔离与接地保护
接口形式:多槽位连接器接口,兼容 AMAT 专用控制/信号模块
电气性能:
高速总线传输能力
EMC/EMI 抑制设计
电源分布网络(PDN)优化
机械特性:标准化尺寸,适配 AMAT 机架或控制箱体
应用场景
半导体制造设备控制系统:连接处理器模块、I/O 模块、电源模块,实现统一的数据与电源分配。
高精度工艺过程控制:确保刻蚀、沉积、离子注入等工艺的实时通信。
系统扩展与维护:支持模块化插拔,便于设备升级与维护。
产品优势
高可靠性:满足半导体设备长周期、高负荷运行要求。
模块化兼容性:支持多种控制与接口模块,提升系统灵活性。
信号完整性保障:通过优化布线和接地,降低串扰与干扰。
易于维护:更换与扩展方便,缩短设备停机时间。
AMAT Applied Materials 0100-02292背板 英文介绍
Product Overview
The AMAT Applied Materials 0100-02292 backplane is a core circuit interconnect component used in semiconductor devices. It usually serves as a communication and power distribution channel between various functional modules of the system, providing signal transmission, power supply, and interface integration. The backplane is used in AMAT's process equipment (such as CVD, PVD, etching machines, etc.) to achieve stable interconnection between the control system and the execution unit.
Technical parameters (typical features, specific model parameters need to be confirmed in conjunction with physical objects/documents)
Product type: Backplane Assembly
Main functions:
High speed signal interconnection between modules
Power distribution and voltage stabilization
Channel isolation and grounding protection
Interface form: Multi slot connector interface, compatible with AMAT dedicated control/signal module
Electrical performance:
High speed bus transmission capability
EMC/EMI suppression design
Optimization of Power Distribution Network (PDN)
Mechanical characteristics: Standardized dimensions, compatible with AMAT racks or control enclosures
Application scenarios
Semiconductor manufacturing equipment control system: connects processor modules, I/O modules, and power modules to achieve unified data and power distribution.
High precision process control: Ensure real-time communication for processes such as etching, deposition, and ion implantation.
System expansion and maintenance: Supports modular plugging and unplugging, facilitating device upgrades and maintenance.
Product advantages
High reliability: meets the long-term and high load operation requirements of semiconductor equipment.
Modular compatibility: Supports multiple control and interface modules to enhance system flexibility.
Signal integrity assurance: By optimizing wiring and grounding, crosstalk and interference are reduced.
Easy to maintain: easy to replace and expand, reducing equipment downtime.
AMAT Applied Materials 0100-02292背板 产品展示
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