AMAT Applied Materials 0190-07908载体板 PDF资料
1.产 品 资 料 介 绍：
产品概述
AMAT 0190-07908 是 Applied Materials 半导体设备中的 载体板（Carrier Board）。
该板主要用于 电子模块或子板的安装和信号/电源连接，在机台内部起到承载、接口分配和信号传递的作用，是控制系统或接口模块可靠运行的基础组件。
技术参数（推断性质）
类型：载体板（Carrier Board / Backplane Board）。
功能：
提供模块化插槽或接口，承载其他 PCB 或电子模块。
分配电源、控制信号和通信信号，实现各模块间连接。
提供机械支撑和可靠接口，确保模块在振动或温度变化环境下稳定运行。
材质：高可靠 PCB 基材，耐热、耐振动、适应半导体洁净环境。
接口类型：板载插槽、连接器或焊点接口，与模块电气连接。
安装位置：控制柜、模块槽位或子系统内，作为模块间的连接桥梁。
特点：高可靠性、模块化、便于维护和扩展。
应用场景
模块支撑与连接
承载控制板、接口板或信号调理板，实现模块的机械固定与电气连接。
信号分配与接口桥接
将控制器、传感器、执行器和其他模块的信号进行集中分配。
系统扩展与维护
模块化设计便于添加、替换或升级设备内部子模块，减少停机时间。
设备稳定性保障
通过可靠的电气连接和机械支撑，确保半导体设备在振动、温度变化和长期运行下的稳定性。
AMAT Applied Materials 0190-07908载体板 英文资料：
Product Overview
AMAT 0190-07908 is a carrier board in Applied Materials semiconductor equipment.
This board is mainly used for the installation of electronic modules or daughter boards and signal/power connections. It plays a role in carrying, interface distribution, and signal transmission inside the machine, and is the basic component for reliable operation of control systems or interface modules.
Technical parameters (inferred properties)
Type: Carrier Board/Backplane Board.
Function:
Provide modular slots or interfaces to support other PCBs or electronic modules.
Allocate power, control signals, and communication signals to achieve connections between modules.
Provide mechanical support and reliable interfaces to ensure stable operation of the module in vibration or temperature changing environments.
Material: High reliability PCB substrate, heat-resistant, vibration resistant, and suitable for semiconductor clean environments.
Interface type: onboard slot, connector or solder joint interface, electrically connected to the module.
Installation location: within the control cabinet, module slot, or subsystem, serving as a connecting bridge between modules.
Features: High reliability, modularity, easy maintenance and expansion.
Application scenarios
Module support and connection
Load control board, interface board or signal conditioning board to achieve mechanical fixation and electrical connection of modules.
Signal allocation and interface bridging
Centralize the distribution of signals from controllers, sensors, actuators, and other modules.
System Expansion and Maintenance
Modular design facilitates the addition, replacement, or upgrade of internal submodules within the device, reducing downtime.
Equipment stability guarantee
Ensure the stability of semiconductor equipment under vibration, temperature changes, and long-term operation through reliable electrical connections and mechanical support.
AMAT Applied Materials 0190-07908载体板 产品展示
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| IC3600KMRE2 | 531X137TRGAAG1 | IC3600AFGA1D1 |
| IC3600KMRD9 | 531X136TBGAAG1 | IC3600AFGA1C1 |
| IC3600KMRD2 | 531X135PRGBBG1 | IC3600AFGA1B |
| IC3600KMRC5 | 531X135PRGAYM2 | IC3600AFGA1 |
| IC3600KMRC2 | 531X135PRGAWM2 | IC3600ADNA1 |
| IC3600KMRB5 | 531X135PRGATM2 | IC3600ADN1A |
| IC3600KMRB2 | 531X135PRGAMM1 | IC3600ADAF1A |
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