AMAT Applied Materials 0010-17814端点探测器 PDF资料
1.产 品 资 料 介 绍：
AMAT Applied Materials 0010-17814 端点探测器（Endpoint Detector）
产品概述
0010-17814 是 AMAT 半导体设备中的 端点探测器模块（Endpoint Detector），用于实时检测半导体加工过程中材料沉积、刻蚀或其他工艺的完成状态（端点）。该模块通过光学、电学或其他传感方式监控工艺进程，为控制器提供精确的工艺完成信号，确保晶圆加工质量和工艺一致性。
技术功能与特点
实时工艺监测
精确检测薄膜沉积、刻蚀或清洗工艺的端点位置。
提供高灵敏度信号，实现工艺终点的及时判断。
闭环工艺控制
将检测信号反馈至控制器，实现自动停止或切换工艺步骤。
支持多通道信号采集，适应复杂工艺要求。
接口与兼容性
与控制器、PCB、量规控制器及伺服模块连接，实现数据传输和工艺联动。
模块化设计，便于升级和维护。
高可靠性设计
适应半导体设备高洁净、高温环境。
具备抗干扰、长期稳定运行和异常报警功能。
应用领域
沉积工艺（CVD / PVD / ALD）
监测薄膜沉积终点，保证膜厚一致性和均匀性。
刻蚀工艺
精确判断刻蚀完成时间，防止过刻或欠刻，保证图形精度。
清洗与表面处理工艺
检测工艺完成状态，确保晶圆表面处理符合要求。
自动化半导体生产线
与控制器和工艺模块协作，实现端点检测自动化和工艺闭环控制。
AMAT Applied Materials 0010-17814端点探测器 英文资料：
AMAT Applied Materials 0010-17814 Endpoint Detector
Product Overview
0010-17814 is an endpoint detector module in AMAT semiconductor equipment, used for real-time detection of the completion status (endpoints) of material deposition, etching, or other processes during semiconductor processing. This module monitors the process progress through optical, electrical, or other sensing methods, providing precise process completion signals to the controller to ensure wafer processing quality and process consistency.
Technical functions and features
Real time process monitoring
Accurately detect the endpoint position of thin film deposition, etching, or cleaning processes.
Provide high-sensitivity signals to achieve timely judgment of process endpoints.
Closed loop process control
Feedback the detection signal to the controller to achieve automatic stopping or switching of process steps.
Support multi-channel signal acquisition to meet complex process requirements.
Interface and compatibility
With the controller PCB、 Connect the gauge controller and servo module to achieve data transmission and process linkage.
Modular design, easy to upgrade and maintain.
High reliability design
Adapt to high cleanliness and high temperature environments for semiconductor equipment.
It has anti-interference, long-term stable operation, and abnormal alarm functions.
Application field
Deposition process (CVD/PVD/ALD)
Monitor the endpoint of thin film deposition to ensure consistency and uniformity of film thickness.
etching process
Accurately determine the completion time of etching, prevent over etching or under etching, and ensure graphic accuracy.
Cleaning and surface treatment process
Check the completion status of the manufacturing process to ensure that the wafer surface treatment meets the requirements.
Automated semiconductor production line
Collaborate with controllers and process modules to achieve automated endpoint detection and closed-loop process control.
AMAT Applied Materials 0010-17814端点探测器 产品展示
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| PXI-8432/4 | GESPAC GESBUS-8M 8638 | DSTX120 57160001-MA |
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