AMAT Applied Materials 0720-05235水阀组件 PDF资料
1.产 品 资 料 介 绍：
AMAT Applied Materials 0720-05235 水阀组件
产品概述
0720-05235 是 AMAT 半导体设备中的 水阀组件（Water Valve Assembly），用于控制设备冷却水或工艺用水的流量与压力。该组件是半导体设备液体冷却和工艺气路系统的重要组成部分，确保关键工艺模块、冷却系统和晶圆承载平台的温度和流体管理精确可靠。
技术功能与特点
精确流量控制
可调节水流量和压力，满足冷却或工艺用水需求。
支持与控制器或量规模块联动，实现闭环流量控制。
快速响应与可靠性
快速开关动作，保证工艺模块或冷却系统实时响应。
高可靠性设计，适应半导体设备长时间连续运行环境。
安全保护机制
内置过压、泄漏及异常报警机制，防止设备损坏。
可与互锁系统配合，实现水路异常时自动停机保护。
模块化与易维护
结构紧凑，便于安装、拆卸和更换。
材料符合半导体洁净室要求，减少污染风险。
应用领域
冷却系统
为冷盘组件、升降机或加热器模块提供精确水流冷却。
工艺液体管理
控制刻蚀、清洗及沉积工艺所需水或其他工艺液体流量。
晶圆承载平台温控
与冷盘组件和温控系统协作，保持晶圆和工艺模块的温度稳定。
自动化生产线液体控制
与控制器和量规模块联动，实现水阀的自动开关和流量调节。
AMAT Applied Materials 1400-00206控制器 英文资料：
AMAT Applied Materials 0720-05235 Water Valve Component
Product Overview
0720-05235 is a water valve assembly in AMAT semiconductor equipment, used to control the flow and pressure of equipment cooling water or process water. This component is an important component of the semiconductor equipment liquid cooling and process gas path system, ensuring precise and reliable temperature and fluid management of key process modules, cooling systems, and wafer carrier platforms.
Technical functions and features
Accurate flow control
Adjustable water flow and pressure to meet cooling or process water requirements.
Support linkage with controllers or gauge modules to achieve closed-loop flow control.
Fast response and reliability
Quick switch action ensures real-time response of process modules or cooling systems.
High reliability design, suitable for long-term continuous operation environment of semiconductor equipment.
Security protection mechanism
Built in overvoltage, leakage, and abnormal alarm mechanisms to prevent equipment damage.
Can be combined with an interlocking system to achieve automatic shutdown protection in case of waterway abnormalities.
Modular and easy to maintain
Compact structure, easy to install, disassemble, and replace.
The material meets the requirements of semiconductor cleanroom and reduces the risk of contamination.
Application field
cooling system
Provide precise water flow cooling for cold plate components, elevators, or heater modules.
Process liquid management
Control the flow rate of water or other process liquids required for etching, cleaning, and deposition processes.
Temperature control of wafer carrier platform
Collaborate with cold plate components and temperature control systems to maintain temperature stability of wafers and process modules.
Automated production line liquid control
Linkage with the controller and gauge module to achieve automatic opening and closing of the water valve and flow regulation.
AMAT Applied Materials 1400-00206控制器 产品展示
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