AMAT Applied Materials 0040-32530冷盘组件 PDF资料
1.产 品 资 料 介 绍：
产品概述
0040-32530 是 AMAT 半导体设备中的 冷盘组件（Cold Plate Assembly），用于对关键工艺模块或晶圆承载平台进行热管理。冷盘组件通过高效导热和液体冷却系统，将设备内部或晶圆表面的热量迅速传导并散发，从而保持工艺温度稳定，保障设备和晶圆安全。
技术功能与特点
高效热管理
通过液体或水冷管路设计，实现快速热量传导和散发。
保持工艺模块或晶圆平台温度稳定，防止热漂移影响工艺质量。
精准温控
可与温度传感器、控制器或电源模块联动，实现闭环温控。
支持高精度温度调节，满足微电子和半导体工艺要求。
模块化结构
设计易于拆装和维护，便于设备升级或冷却介质更换。
适应半导体洁净室标准，防止污染和颗粒扩散。
安全与保护
内置过温或冷却异常报警机制，避免晶圆或设备损坏。
可与设备互锁系统联动，实现自动停机保护。
应用领域
晶圆承载平台冷却
为 ESC（静电卡盘）或晶圆支撑台提供温控，保证晶圆加工温度稳定。
加热器及工艺模块温控
与热离子加热器、加热板或其他发热模块配合，防止过热。
半导体设备温控系统
在沉积、刻蚀、清洗及其他工艺模块中，实现局部或整体温控。
自动化生产线辅助冷却
对升降机、气动模块或功率电子模块进行散热，保障设备稳定运行。
AMAT Applied Materials 0040-32530冷盘组件 英文资料：
Product Overview
0040-32530 is a Cold Plate Assembly in AMAT semiconductor equipment, used for thermal management of critical process modules or wafer carrier platforms. The cold plate component quickly conducts and dissipates the heat inside the equipment or on the surface of the wafer through efficient heat conduction and liquid cooling systems, thereby maintaining stable process temperature and ensuring equipment and wafer safety.
Technical functions and features
Efficient thermal management
By designing liquid or water-cooled pipelines, rapid heat conduction and dissipation can be achieved.
Maintain stable temperature of process modules or wafer platforms to prevent thermal drift from affecting process quality.
Precise Temperature Control
It can be linked with temperature sensors, controllers, or power modules to achieve closed-loop temperature control.
Support high-precision temperature regulation to meet the requirements of microelectronics and semiconductor processes.
Modular structure
The design is easy to disassemble and maintain, making it convenient for equipment upgrades or replacement of cooling media.
Adapt to semiconductor cleanroom standards to prevent contamination and particle diffusion.
Security and protection
Built in overheating or cooling abnormal alarm mechanism to prevent damage to wafers or equipment.
It can be linked with the device interlock system to achieve automatic shutdown protection.
Application field
Cooling of wafer carrier platform
Provide temperature control for ESC (electrostatic chuck) or wafer support platform to ensure stable wafer processing temperature.
Heater and process module temperature control
Cooperate with hot ion heaters, heating plates, or other heating modules to prevent overheating.
Semiconductor equipment temperature control system
Realize local or overall temperature control in deposition, etching, cleaning, and other process modules.
Automated production line auxiliary cooling
Heat dissipation for elevators, pneumatic modules, or power electronic modules to ensure stable operation of the equipment.
AMAT Applied Materials 0040-32530冷盘组件 产品展示
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