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AMAT Applied Materials 0010-08670顶盖

AMAT Applied Materials 0010-08670顶盖

AMAT Applied Materials 0010-08670顶盖 PDF资料 1.产 品 资 料 介 绍:AMAT Applied Materials 0021-96788 气动模块产品概述0021-96788 是 AMAT 半导体设备中的 气动模块(Pneumatic Module),用于控制设备内的气动执行元件,如阀门、气缸和真空泵。该模块通过精确控制气压和气流,实现半导体工艺设备中各...

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AMAT Applied Materials 0010-08670顶盖

    AMAT Applied Materials  0010-08670顶盖 PDF资料 

    1.产 品 资 料 介 绍:

    AMAT Applied Materials 0010-08670 顶盖

    产品概述

    0010-08670 是 AMAT 半导体设备中的 顶盖组件(Top Cover / Chamber Lid),主要用于封闭工艺腔体或关键模块,保证设备在真空或受控气氛条件下安全运行。顶盖不仅起到机械保护作用,还通常集成密封、接口与监控功能,是保证工艺稳定性和设备安全的重要部件。


    技术功能与特点

    1. 密封与真空保持

      • 顶盖配备高性能密封件,保证腔体或工艺模块的真空完整性。

      • 防止外部空气或杂质进入,确保工艺环境纯净。

    2. 机械保护

      • 保护腔体内部晶圆和精密组件免受机械损伤。

      • 结构坚固,可承受真空差和设备运行震动。

    3. 接口与传感器安装

      • 顶盖通常设计有接口,可安装气体管路、电气连接或传感器。

      • 支持温度、压力或位置监控,实现闭环工艺控制。

    4. 安全互锁设计

      • 顶盖与设备控制器联动,当未完全关闭或密封异常时,阻止设备启动。

      • 保护晶圆和设备安全,避免误操作造成损坏。

    5. 模块化设计

      • 结构可拆卸、可更换,便于设备维护和升级。

      • 设计符合半导体洁净室标准,易于清洁和保养。


    应用领域

    1. CVD / PVD 工艺腔体

      • 用于封闭沉积或溅射腔体,维持真空和气体纯净环境。

    2. 刻蚀设备

      • 顶盖作为腔体的机械封闭组件,确保等离子体或反应气体控制精确。

    3. 晶圆搬运与 Loadlock 系统

      • 顶盖与升降机、气动模块配合,实现晶圆安全进出腔体。

    4. 高洁净自动化生产线

      • 保持设备内部洁净度,防止颗粒污染影响工艺质量。

    AMAT Applied Materials  0010-08670顶盖 英文资料:

    AMAT Applied Materials 0010-08670 Top Cover

    Product Overview

    0010-08670 is a top cover/Chamber Lid component in AMAT semiconductor equipment, mainly used to seal process chambers or critical modules, ensuring safe operation of the equipment under vacuum or controlled atmosphere conditions. The top cover not only provides mechanical protection, but also typically integrates sealing, interface, and monitoring functions, making it an important component for ensuring process stability and equipment safety.

    Technical functions and features

    Sealing and Vacuum Maintenance

    The top cover is equipped with high-performance seals to ensure the vacuum integrity of the cavity or process module.

    Prevent external air or impurities from entering and ensure a pure process environment.

    mechanical protection

    Protect the wafers and precision components inside the cavity from mechanical damage.

    The structure is sturdy and can withstand vacuum differences and equipment operation vibrations.

    Interface and sensor installation

    The top cover is usually designed with interfaces that can accommodate gas pipelines, electrical connections, or sensors.

    Support temperature, pressure, or position monitoring to achieve closed-loop process control.

    Security interlock design

    The top cover is linked with the device controller to prevent the device from starting when it is not fully closed or sealed abnormally.

    Protect the safety of wafers and equipment to avoid damage caused by misoperation.

    modular design

    The structure is detachable and replaceable, making it easy to maintain and upgrade the equipment.

    Designed to meet semiconductor cleanroom standards, easy to clean and maintain.

    Application field

    CVD/PVD process chamber

    Used to seal deposition or sputtering chambers, maintain vacuum and gas purity environment.

    Etching equipment

    The top cover serves as a mechanical sealing component of the cavity, ensuring precise control of plasma or reactive gases.

    Wafer Handling and Loadlock System

    The top cover cooperates with the elevator and pneumatic module to achieve safe entry and exit of wafers into the cavity.

    High cleanliness automated production line

    Maintain the cleanliness inside the equipment to prevent particle contamination from affecting process quality.

    AMAT Applied Materials  0010-08670顶盖 产品展示      

    applied_materials_0010-08670_chamber_top_cover_amat.jpg

    3.其他产品

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    本篇文章出自瑞昌明盛自动化设备有限公司官网,转载请附上此链接:http://www.jiangxidcs

    品牌:AMAT Applied Materials


    型号: 0010-08670顶盖


    质保:一年


    成色:全新/二手


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