AMAT Applied Materials 0190-26327热离子加热器 PDF资料
1.产 品 资 料 介 绍:
AMAT Applied Materials 0190-26327 热离子加热器
产品概述
0190-26327 是应用于 AMAT 半导体设备中的 热离子加热器组件。它主要作为一种高温加热单元,利用热离子发射效应或高效电热结构,为工艺腔体或特定组件提供均匀、稳定的热源。该部件常用于薄膜沉积、表面处理和晶圆加热工艺中,是确保工艺温度精确可控的重要硬件。
技术功能与特点
高温加热能力
可提供稳定且可控的高温环境,用于激活反应气体或加速表面反应。
支持快速升温和降温,满足半导体工艺的动态温控需求。
热离子效应
利用加热元件在高温下的电子发射特性,提升表面活化效果。
在某些工艺中可用于辅助等离子体生成或提高反应效率。
均匀加热
通过优化结构设计实现局部区域的温度均匀性,避免晶圆受热不均。
集成保护设计
配合温度传感器与联锁系统,防止过热损坏。
具备冗余安全机制,确保在异常状态下自动切断电源。
应用领域
CVD(化学气相沉积)设备
用于预热气体、促进反应物分解,提高薄膜沉积质量。
辅助实现高质量氧化物、氮化物和金属薄膜的沉积。
PVD(物理气相沉积)设备
在溅射镀膜过程中为靶材或工艺区域提供热激活条件。
用于改善薄膜的结晶度与致密性。
刻蚀工艺
通过加热激发表面反应,提高刻蚀速率或刻蚀均匀性。
晶圆预处理与清洗
在晶圆进入反应腔前,进行预热以去除水分或有机残留。
配合等离子清洗工艺提升表面洁净度。
AMAT Applied Materials 0190-26327热离子加热器 英文资料:
AMAT Applied Materials 0190-26327 Thermal Ion Heater
Product Overview
0190-26327 is a thermal ion heater component used in AMAT semiconductor equipment. It mainly serves as a high-temperature heating unit, utilizing the thermal ion emission effect or efficient electric heating structure to provide a uniform and stable heat source for process chambers or specific components. This component is commonly used in thin film deposition, surface treatment, and wafer heating processes, and is an important hardware to ensure precise and controllable process temperature.
Technical functions and features
High temperature heating capacity
Can provide a stable and controllable high-temperature environment for activating reactive gases or accelerating surface reactions.
Support rapid heating and cooling to meet the dynamic temperature control requirements of semiconductor processes.
thermionic effect
Utilize the electron emission characteristics of heating elements at high temperatures to enhance the surface activation effect.
In certain processes, it can be used to assist in plasma generation or improve reaction efficiency.
uniform heating
By optimizing the structural design, temperature uniformity in local areas can be achieved to avoid uneven heating of the wafer.
Integrated protection design
Cooperate with temperature sensors and interlocking systems to prevent overheating and damage.
Equipped with redundant safety mechanisms to ensure automatic power cut-off in case of abnormal conditions.
Application field
CVD (Chemical Vapor Deposition) equipment
Used for preheating gases, promoting the decomposition of reactants, and improving the quality of thin film deposition.
Assist in the deposition of high-quality oxide, nitride, and metal thin films.
PVD (Physical Vapor Deposition) equipment
Provide thermal activation conditions for the target material or process area during the sputtering coating process.
Used to improve the crystallinity and density of thin films.
etching process
By stimulating surface reactions through heating, the etching rate or uniformity can be improved.
Wafer pretreatment and cleaning
Preheat the wafer before entering the reaction chamber to remove moisture or organic residues.
Cooperate with plasma cleaning process to improve surface cleanliness.
AMAT Applied Materials 0190-26327热离子加热器 产品展示
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