AMAT Applied Materials 0660-01879印刷电路板 PDF资料
1.产 品 资 料 介 绍：
AMAT Applied Materials 0660-01879 印刷电路板
产品概述
0660-01879 是应用于 AMAT 半导体工艺设备中的 印刷电路板（Printed Circuit Board，PCB）。它属于设备内部的电子控制模块，作为信号处理与控制逻辑的核心部件，用于连接、驱动并管理系统中的各类子模块（如气体面板、真空系统、联锁控制、温度与功率调节等）。
技术功能与特点
信号处理与分配
接收来自传感器（温度、压力、位置等）的信号并进行调理。
将处理后的信号传输到上位控制器或相关执行部件。
控制与执行
通过电路驱动阀门、继电器、马达、加热器等执行元件。
实现开关、调节、互锁等功能逻辑。
系统互联
在主控制系统（如 PLC、工业计算机）与现场子系统之间建立电气连接。
作为 I/O 板卡，为外设提供稳定的输入输出通道。
模块化与可维护性
采用标准化板卡设计，支持快速替换。
便于设备维护和升级，缩短停机时间。
应用领域
CVD（化学气相沉积）设备
管理气体面板与腔体控制信号，保证气体输送与沉积工艺的稳定。
PVD（物理气相沉积）设备
控制溅射电源、气路阀门、真空泵等外设运行，确保镀膜过程一致性。
刻蚀设备
处理气体流量、射频电源及腔体状态信号，执行互锁保护。
清洗/表面处理设备
控制等离子体源、加热单元以及气体输入，保障清洗工艺的可控性。
晶圆传输与Loadlock系统
管理舱门、传感器和机器人接口，支持自动化搬运的安全运行。
AMAT Applied Materials 0660-01879印刷电路板 英文资料：
AMAT Applied Materials 0100-01652 Gas Panel
Product Overview
0100-01652 is a gas panel module used in AMAT semiconductor process equipment. As a key subsystem for gas delivery and control, it is used to stably and safely deliver various high-purity gases required for the process (such as SiH ₄, NH ∝, N ₂, Ar, etc.) to the vacuum reaction chamber at the set flow rate and pressure.
Technical functions and features
Gas flow control
Integrated Mass Flow Controller (MFC) to precisely regulate the flow rate of each process gas.
Support multi-channel gas distribution to meet the requirements of complex process formulas.
Gas path switching and allocation
Gas switching and path switching are achieved through solenoid valves, diaphragm valves, etc.
Designed to prevent cross contamination of gases.
Pressure and purity assurance
Equipped with pressure sensors and regulating valves to ensure that gas enters the process chamber at an appropriate pressure.
The pipelines and valves are made of stainless steel or high-purity materials to ensure gas purity and avoid particles or impurities.
Security and Interlocking
Equipped with gas leak detection and automatic shut-off mechanism.
Interlock with the overall control system and automatically close the air circuit in case of abnormal conditions.
Application field
Chemical Vapor Deposition (CVD) Equipment
Used to control the ratio and flow rate of precursor gas and reaction gas, achieving thin film deposition (such as SiO ₂, Si ∝ N ₄, metal oxides, etc.).
Physical Vapor Deposition (PVD) equipment
In the sputtering process, introducing working gas (such as Ar) or reactive gas (such as O ₂, N ₂) controls the deposition characteristics.
Etch etching equipment
Accurately mix CF ₄, CHF ∝, Cl ₂ and other gases to adjust the etching rate and selectivity.
Cleaning and surface treatment equipment
Transport gases such as O ₂ and H ₂ for plasma cleaning or surface activation treatment.
AMAT Applied Materials 0660-01879印刷电路板 产品展示
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4.其他英文产品
ABB YB560103-CE DSQC236T Voltage module
ABB YB560103-CH DSQC239 Relay input module
ABB YB560103-CL DSQC241 Relay output module
| SR489-P5-HI-A20 | SC402-037-T3 | SC903AN-001-01 |
| SR489-CASE | SC403-002-T4 | SC904NN-001-01 |
| SR469-P5-LO-A20-T | SC402-011-T3 | SC933-050-01 |
| SR469-P5-LO-A20-E | SC452-044-05 | SC903-020-01 |
| SR469-P5-LO-A20 | AMAT 0100-09050 | SC903TN-001-01 |
| SR469-P5-HI-A20-T | AMAT 0100-00689 | PFEA 113, IP 65 |
| SR469-P5-HI-A20-E-H | AMAT 0100-A0491 | PFCL 301E-0.2 |
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