HIER466513P111模块卡件，ABB使用配置手册
冷却要求摩托罗拉MVME2603/2604系列单板计算机是规定、设计和测试以在进气情况下可靠运行强制风冷的温度范围为0°至55°C（32°至131°F）整个组件（基板和模块）的速度通常为可通过使用100 CFM轴流风机实现。温度鉴定为在标准摩托罗拉VME系统机箱中执行。25瓦负载电路板插入两个卡槽中，每侧一个，与测试板，以模拟高功率密度系统配置。
HIER466513P111模块卡件放置一个由三个轴流风机组成的总成，每个风机的额定功率为100 CFMVME卡固定框架正下方。进气温度为在风扇组件和卡固定框架之间测量，其中输入气流首先遇到被测模块。执行测试软件由于模块受到环境温度变化的影响。案例关键的高功率密度集成电路的温度是监控以确保不超过组件供应商的规格。而冷却所需的确切风量取决于环境空气温度和电路板的类型、数量和位置，以及对于其他热源，通常可以使用10 CFM实现充分冷490线性调频流过模块。需要更少的气流来冷却具有较低最大环境的环境中的模块。在“更多”下良好的热条件下，可以操作模块在高于55°C且气流增加的情况下可靠运行。值得注意的是除了空气动力装置的额定CFM外，还有几个因素，这决定了空气流过管道的实际体积和速度单元规格表A-1列出了MVME2603/2604基座的一般规范董事会。后续章节详细介绍了冷却要求和FCC顺从MVME2603/2604基板的完整功能说明见第3章，功能描述。技术规范可选PCI夹层可在以下各项的文档中找到：模块。表A-1。MVME2603/2604规格特性规范功率要求（不包括过渡模块，键盘、鼠标）
+5V DC（±5%），典型5A，最大7A（MPC603处理器）；6A典型，最大8A（MPC604处理器）+12V DC（±5%），典型250mA，1A最大值–12V DC（±5%），典型100mA，最大250mA
Cooling Requirements
The Motorola MVME2603/2604 family of single board computers is
specified, designed, and tested to operate reliably with an incoming air
temperature range from 0° to 55° C (32° to 131° F) with forced air cooling
of the entire assembly (base board and modules) at a velocity typically
achievable by using a 100 CFM axial fan. Temperature qualification is
performed in a standard Motorola VME system chassis. 25-watt load
boards are inserted in two card slots, one on each side, adjacent to the
board under test, to simulate a high power density system configuration.
An assembly of three axial fans, rated at 100 CFM per fan, is placed
directly under the VME card cage. The incoming air temperature is
measured between the fan assembly and the card cage, where the incoming
airstream first encounters the module under test. Test software is executed
as the module is subjected to ambient temperature variations. Case
temperatures of critical, high power density integrated circuits are
monitored to ensure component vendors’ specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the module. Less airflow is required to cool the
module in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the module
reliably at higher than 55° C with increased airflow. It is important to note
that there are several factors, in addition to the rated CFM of the air mover,
which determine the actual volume and speed of air flowing over a
module.Specifications
Table A-1 lists the general specifications for MVME2603/2604 base
boards. Subsequent sections detail cooling requirements and FCC
compliance.
A complete functional description of the MVME2603/2604 base boards
appears in Chapter 3, Functional Description. Specifications for the
optional PCI mezzanines can be found in the documentation for those
modules.
Table A-1. MVME2603/2604 Specifications
Characteristics Specifications
Power requirements
(Excluding transition module,
keyboard, mouse)
+5V DC (±5%), 5A typical, 7A maximum
(MPC603 processor); 6A typical,
8A maximum (MPC604 processor)
+12V DC (±5%), 250mA typical,
1A maximum
–12V DC (±5%), 100mA typical,
250mA maximum
