Gasonics A94-060-01真空臂组件 PDF资料
1.产 品 资 料 介 绍：
产品概述：
Gasonics A94-060-01 是一款应用于半导体设备中的真空机械臂组件，主要功能是在真空或低压环境中搬运晶圆或工艺载体。该组件为自动化处理设备提供可靠的取放支持，是设备内部晶圆传输系统的重要组成部分。
技术参数（典型）：
组件类型：真空机械臂
工作环境：真空或洁净腔体内
控制方式：配合电机或气动驱动系统进行移动
结构材料：真空兼容金属与工程塑料
运动方式：水平直线/旋转/升降（依据设备配置）
安装位置：设备处理腔体内部或接口站位
搭载功能：可连接末端夹具用于晶圆抓取与放置
应用场景：
晶圆搬运
在清洗、剥离、刻蚀等工艺环节，将晶圆从一个腔体或载台传送至另一个工位。设备自动化系统
作为自动装卸系统的一部分，实现无人化转运，提高设备运行效率。真空处理环境
专为在高洁净度、低压环境下运行而设计，确保无颗粒释放和可靠运行。Gasonics 等离子体处理设备
与 Aura、L3510 等系列设备配套，用于腔体内部物料的转移。
产品优势：
精密控制，运动稳定，定位准确
真空兼容性强，满足半导体洁净要求
可更换性强，适用于设备维护和部件替换
提高晶圆处理效率，减少人工干预
英文资料：
Product Overview:
Gasonics A94-060-01 is a vacuum robotic arm component used in semiconductor equipment, primarily for handling wafers or process carriers in vacuum or low-pressure environments. This component provides reliable handling support for automated processing equipment and is an important component of the internal wafer transfer system of the equipment.
Technical parameters (typical):
Component type: Vacuum robotic arm
Working environment: inside a vacuum or clean chamber
Control method: Move in conjunction with a motor or pneumatic drive system
Structural materials: Vacuum compatible metals and engineering plastics
Movement mode: horizontal straight line/rotation/lifting (depending on equipment configuration)
Installation location: Inside the equipment processing chamber or at the interface station
Function: Can be connected to end fixtures for wafer gripping and placement
Application scenarios:
Wafer handling
In the process of cleaning, peeling, etching, etc., the wafer is transferred from one chamber or stage to another workstation.
eap
As part of the automatic loading and unloading system, unmanned transportation is implemented to improve equipment operation efficiency.
Vacuum processing environment
Specially designed for operation in high cleanliness and low pressure environments, ensuring no particle release and reliable operation.
Gasonics plasma processing equipment
Paired with Aura, L3510 and other series of equipment, it is used for transferring materials inside the cavity.
Product advantages:
Precise control, stable movement, accurate positioning
Strong vacuum compatibility, meeting the requirements of semiconductor cleanliness
Strong replaceability, suitable for equipment maintenance and component replacement
Improve wafer processing efficiency and reduce manual intervention
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