Tokyo Electron AQA-K09-TYP2冷却器组件 PDF资料
1.产 品 资 料 介 绍：
中文资料：
Tokyo Electron AQA-K09-TYP2 冷却器组件（Chiller Unit / Cooling Assembly） 是一款用于 TEL 半导体制造设备中的温控系统关键部件，主要负责为工艺模块（如反应腔、光源、电子组件等）提供精准的温度调节和热交换功能，以保障工艺稳定性与设备安全运行。
一、产品基本属性
产品名称：冷却器组件（Chiller / Cooler Unit）
产品型号：AQA-K09-TYP2
制造商：Tokyo Electron Ltd.
模块用途：液体或气体温度控制（可能为内置或外接型冷却模块）
二、功能与作用
| 功能类别 | 具体说明 |
|---|---|
| 温控管理 | 控制工艺模块、电子系统或液体回路的温度，使之维持在预设稳定范围 |
| 热交换系统 | 利用冷媒或 DIW（去离子水）等循环流体带走热量，实现连续冷却 |
| 集成控制接口 | 与设备主控系统（如 PLC 或温控控制器）连接，实现温度反馈闭环控制 |
| 工艺保护功能 | 防止温度漂移造成设备过热、腔体膨胀、薄膜厚度不均或电气元件损坏等问题 |
三、典型应用领域
| 应用模块 | 冷却用途 |
|---|---|
| 腔体冷却 | 控制反应腔体壁面温度，避免粒子生成或反应不均 |
| RF 模块冷却 | 保持射频功率器件稳定运行，延长电源和匹配器寿命 |
| 化学液/显影液冷却系统 | 稳定液体温度，控制化学反应速率与晶圆表面处理一致性 |
| 激光/光源组件温控系统 | 降低光源发热造成的波长漂移或光强波动，提高图形成像质量 |
英文资料：
The Tokyo Electron AQA-K09-TYP2 Chiller Unit/Cooling Assembly is a key component of the temperature control system used in TEL semiconductor manufacturing equipment. It is mainly responsible for providing precise temperature regulation and heat exchange functions for process modules such as reaction chambers, light sources, electronic components, etc., to ensure process stability and safe equipment operation.
1、 Basic Product Attributes
Product Name: Chiller/Cooler Unit
Product model: AQA-K09-TYP2
Manufacturer: Tokyo Electron Ltd
Module purpose: Liquid or gas temperature control (may be an internal or external cooling module)
2、 Function and Function
Specific description of functional categories
Temperature control management controls the temperature of process modules, electronic systems, or liquid circuits to maintain it within a predetermined stable range
The heat exchange system utilizes circulating fluids such as refrigerant or DIW (deionized water) to remove heat and achieve continuous cooling
Connect the integrated control interface with the main control system of the equipment (such as PLC or temperature controller) to achieve temperature feedback closed-loop control
The process protection function prevents temperature drift from causing equipment overheating, cavity expansion, uneven film thickness, or damage to electrical components
3、 Typical application areas
Application module cooling purpose
Chamber cooling controls the temperature of the reaction chamber wall to avoid particle generation or uneven reaction
RF module cooling maintains stable operation of RF power devices, extending the lifespan of power supply and matching devices
Chemical/developer cooling system stabilizes liquid temperature, controls chemical reaction rate and ensures consistency with wafer surface treatment
The temperature control system of laser/light source components reduces wavelength drift or light intensity fluctuations caused by light source heating, and improves the quality of graphic imaging
2.产 品 展 示
3.其他产品
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