Tokyo Electron 3D81-000102-V1接口板 PDF资料
1.产 品 资 料 介 绍:
中文资料:
Tokyo Electron (TEL) 3D81-000102-V1 接口板 — 产品应用领域详解
一、产品功能定位
3D81-000102-V1 接口板是 Tokyo Electron 半导体制造设备中用于信号转换、控制通信和模块互联的重要部件。它作为设备控制系统与外部执行单元之间的数据桥梁,在设备运行过程中起到“控制中枢延伸”的作用。
二、主要应用领域
1. 设备模块间通信接口
功能说明:将主控系统(如主控制器、处理器模块)与子系统(如气体控制单元、温控模块、马达控制器)连接;
应用价值:确保各功能模块间信号完整性与同步操作,提升系统反应速度与整体协同能力;
典型设备:用于 TEL 的刻蚀机、CVD 设备、显影系统等中。
2. I/O 信号输入输出分发与管理
功能说明:负责收集来自传感器、执行机构(如电磁阀、伺服马达等)的输入信号,并输出控制信号;
接口类型:可能包含数字量(DI/DO)、模拟量(AI/AO)、通讯端口(如 RS-232、RS-485、CAN、Ethernet 等);
作用场景:温度控制、气流调节、压力检测、电机驱动信号交互等。
3. 多系统协同控制桥接单元
协同作用:支持多个子系统数据互联,实现设备整体运行的同步控制;
总线支持:可能内嵌支持标准工业通信协议,如 I²C、SPI、MODBUS、SECS/GEM 等;
工艺保障:使晶圆加工过程中的各子系统协调运行,避免延迟或干扰。
英文资料:
Tokyo Electron (TEL) 3D81-000102-V1 Interface Board - Detailed Explanation of Product Application Fields
1、 Product functional positioning
The 3D81-000102-V1 interface board is an important component used for signal conversion, control communication, and module interconnection in Tokyo Electron semiconductor manufacturing equipment. It serves as a data bridge between the device control system and external execution units, playing a role as a "control center extension" during the operation of the device.
2、 Main application areas
1. Communication interface between device modules
Function description: Connect the main control system (such as the main controller, processor module) with subsystems (such as gas control unit, temperature control module, motor controller);
Application value: Ensure signal integrity and synchronous operation between various functional modules, improve system response speed and overall collaboration capability;
Typical equipment: used in TEL etching machines, CVD equipment, developing systems, etc.
2. I/O signal input/output distribution and management
Function description: Responsible for collecting input signals from sensors, actuators (such as solenoid valves, servo motors, etc.), and outputting control signals;
Interface types: may include digital signals (DI/DO), analog signals (AI/AO), communication ports (such as RS-232, RS-485, CAN, Ethernet, etc.);
Application scenarios: temperature control, airflow regulation, pressure detection, motor drive signal interaction, etc.
3. Multi system collaborative control bridge unit
Collaboration: Support data interconnection among multiple subsystems to achieve synchronous control of overall device operation;
Bus support: may embed support for standard industrial communication protocols such as I ² C, SPI, MODBUS, SECS/GEM, etc;
Process assurance: Ensure the coordinated operation of various subsystems during wafer processing to avoid delays or interference.
2.产 品 展 示
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