Tokyo Electron 2L08-050066-12印刷电路板 PDF资料
1.产 品 资 料 介 绍：
中文资料：
Tokyo Electron (TEL) 2L08-050066-12 印刷电路板 — 产品应用领域详解
一、产品功能定位
2L08-050066-12 印刷电路板（PCB）是 Tokyo Electron 半导体设备中的关键电子部件，通常用于承载控制逻辑、电源分配、信号处理等功能模块，是设备内部信号和电力传输的基础平台。
二、主要应用领域
1. 设备控制系统核心电路支撑
用作控制系统的主板或子板，承载 MCU、FPGA、I/O 控制芯片等关键元件；
实现晶圆处理设备（如刻蚀机、CVD、涂胶显影机）中各子系统的逻辑控制与状态协调。
2. 信号采集与接口转换
集成多种传感器接口、AD/DA 模块、通信端口；
在设备中充当桥梁，连接温控系统、气压控制、马达驱动模块等执行部件与中央控制器。
3. 电源调配与稳压滤波功能
承载电源模块和稳压电路，为其它功能板卡提供稳定的低压直流电源；
实现对不同电压等级的分配、过载保护、电磁干扰抑制。
4. 系统通信与总线集成
提供设备内部如 I²C、SPI、RS-485、CAN 等通信总线接口；
支持与主控系统及外部设备之间的高速数据交换。
三、典型应用设备
等离子刻蚀系统（Etcher）
控制气体流量、电极电压、真空系统等环节。薄膜沉积设备（CVD、ALD）
管理温度、时间、反应物注入等工艺参数。涂胶显影设备（Coater/Developer）
用于控制旋转速度、显影时间、曝光区域识别等。设备通讯中继与数据分发节点
可作为系统内多个子模块的通信节点，提高数据协调效率。
英文资料：
Tokyo Electron (TEL) 2L08-05006-12 Printed Circuit Board - Detailed Explanation of Product Application Fields
1、 Product functional positioning
The 2L08-050066-12 printed circuit board (PCB) is a critical electronic component in Tokyo Electron semiconductor equipment, typically used to carry functional modules such as control logic, power distribution, and signal processing. It serves as the foundational platform for internal signal and power transmission within the equipment.
2、 Main application areas
1. Core circuit support for equipment control system
Used as a motherboard or daughter board for control systems, carrying key components such as MCU, FPGA, I/O control chips, etc;
Implement logical control and state coordination of various subsystems in wafer processing equipment (such as etching machines, CVD, coating and developing machines).
2. Signal acquisition and interface conversion
Integrate multiple sensor interfaces, AD/DA modules, and communication ports;
Act as a bridge in the device, connecting the execution components such as temperature control system, air pressure control, motor drive module, etc. with the central controller.
3. Power allocation and voltage regulation filtering function
Carrying power modules and stabilizing circuits, providing stable low-voltage DC power for other functional boards;
Realize the allocation of different voltage levels, overload protection, and electromagnetic interference suppression.
4. System communication and bus integration
Provide internal communication bus interfaces such as I ² C, SPI, RS-485, CAN, etc;
Support high-speed data exchange between the main control system and external devices.
3、 Typical application devices
Plasma etching system (Etcher)
Control gas flow rate, electrode voltage, vacuum system and other aspects.
Thin film deposition equipment (CVD, ALD)
Manage process parameters such as temperature, time, and reactant injection.
Coater/Developer
Used to control rotation speed, development time, exposure area recognition, etc.
Device communication relay and data distribution node
Can serve as a communication node for multiple sub modules within the system, improving data coordination efficiency.
2.产 品 展 示
3.其他产品
ABB CHBX01R 2VAA008575R1 冗余模块底座
4.其他英文产品
GE 151X1235DB15SA01 power converter
GE IS200TRLYH1B power converter
ASEA DSQC108 controller backplane
| 4145J42-G01 | P81010Z1200002 | PFCL 201CE-5.0KN |
| 4136J63G1 | HG96A603 | TRICONEX 3664 |
| 4136J63-G01 | SS7PG-48BMC | IMDSI22 |
| 40PA60-36-37-TEFC-G | HG932A6 | IMDSM04 |
| 40PA59-55-TEFC-S | 193X735ACG01 | 067-10098-0000 |
| 40PA58-53-TEFC-S | PRD-SC30000Z-41 | 0AF00 |
