Tokyo Electron 2L39-000065-31发电机 PDF资料
1.产 品 资 料 介 绍：
中文资料：
Tokyo Electron 2L39-000065-31 发电机 — 产品应用领域详解
1. 射频/等离子体电源系统中的功率源
核心功能：2L39-000065-31 发电机可能作为等离子体源的射频（RF）发电模块，为刻蚀或CVD等等离子工艺提供高频电能。
适用工艺：如反应离子刻蚀（RIE）、感应耦合等离子体（ICP）、等离子清洗、PECVD 等半导体制造环节。
工艺优势：稳定输出射频功率，确保等离子体稳定激发，提高工艺重复性与制程控制精度。
2. 半导体设备中专用电能转换模块
电源角色：作为内部发电组件，为特定工艺模块提供定制化的电压/频率转换。
多种形式：可为 DC、RF 或中频（MF）等不同频率范围的发电用途，配合匹配器、整流器等模块一同工作。
接口应用：通常与射频匹配网络、温控模块、电极或反应腔集成使用。
3. 设备自主能量供应与过程稳定保障
系统独立性：通过内建发电模块可减少对外部电网波动的依赖，提升整机抗干扰能力。
动态响应：支持快速启动与功率调整，满足不同阶段制程需求。
4. 应用设备范围
典型配套设备：
干法刻蚀机（Etcher）
PECVD 设备
等离子清洗系统
表面改质/蚀刻设备等
主要行业：
半导体晶圆制造
微机电系统（MEMS）
光电元件与显示器件加工
英文资料：
Tokyo Electron 2L39-000065-31 Generator - Detailed Explanation of Product Application Fields
1. Power source in RF/plasma power supply system
Core function: 2L39-000065-31 generator may serve as a radio frequency (RF) power generation module for plasma sources, providing high-frequency electrical energy for plasma processes such as etching or CVD.
Applicable processes: such as reactive ion etching (RIE), inductively coupled plasma (ICP), plasma cleaning, PECVD and other semiconductor manufacturing processes.
Process advantages: Stable output RF power, ensuring stable plasma excitation, improving process repeatability and process control accuracy.
2. Specialized electrical energy conversion module for semiconductor equipment
Power role: As an internal power generation component, it provides customized voltage/frequency conversion for specific process modules.
Multiple forms: It can be used for power generation in different frequency ranges such as DC, RF, or intermediate frequency (MF), and works together with matching devices, rectifiers, and other modules.
Interface application: usually integrated with RF matching networks, temperature control modules, electrodes, or reaction chambers.
3. Equipment autonomous energy supply and process stability guarantee
System independence: The built-in power generation module can reduce dependence on external power grid fluctuations and enhance the overall anti-interference ability of the machine.
Dynamic response: supports fast start-up and power adjustment to meet the requirements of different stages of the process.
4. Scope of application devices
Typical supporting equipment:
Dry Etcher
PECVD equipment
Plasma cleaning system
Surface modification/etching equipment, etc
Main industries:
Semiconductor wafer manufacturing
Micro Electro Mechanical Systems (MEMS)
Processing of optoelectronic components and display devices
2.产 品 展 示
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