Tokyo Electron 1D08-000092-13通信板 PDF资料
1.产 品 资 料 介 绍：
中文资料：
TEL Tokyo Electron 1D08-000092-13 通信板
（Communication Board / Interface Communication PCB）
产品功能简介：
该通信板是 Tokyo Electron（TEL）半导体设备中用于设备内部各模块之间通信连接和数据交换的核心接口模块。其功能通常包括：
提供主控制系统与下位模块之间的通信链路
实现设备内子系统的数据同步、状态反馈和命令下发
支持多种工业通信协议，如 RS-232、RS-485、CAN、Ethernet、DeviceNet、Profibus 等
集成信号缓冲、电气隔离、防干扰处理等功能
作为 I/O 板、控制板、传感器模块等子系统的通信桥梁
主要应用领域：
1. 主控系统与子系统通信中枢
用于设备主控单元（如 SBC 或主控制器）与 I/O 模块、执行机构、HMI 等模块之间的数据传输
确保设备动作指令和反馈信号在子系统之间高速可靠传递
2. 通信接口转换与协议中继
提供不同协议间的接口桥接（如 RS-232 转 TTL、CAN 转串口等）
支持跨模块或多子系统联动操作
3. 状态监测与数据采集
传输来自传感器或检测电路的实时信号（如温度、压力、位置等）
协助实现闭环控制和工艺数据记录
4. 系统诊断与远程维护支持
具备与外部 PC、HMI 或远程控制系统对接的能力
支持设备日志上传、远程升级、系统调试等功能
英文资料：
TEL Tokyo Electron 1D08-000092-13 Communication Board
（Communication Board / Interface Communication PCB）
Product Function Introduction:
This communication board is the core interface module used in Tokyo Electron (TEL) semiconductor equipment for communication connections and data exchange between various modules within the device. Its functions usually include:
Provide communication links between the main control system and lower level modules
Realize data synchronization, status feedback, and command issuance of subsystems within the device
Supports multiple industrial communication protocols, such as RS-232, RS-485, CAN, Ethernet, DeviceNet, Profibus, etc
Integrated signal buffering, electrical isolation, anti-interference processing and other functions
As a communication bridge for subsystems such as I/O boards, control boards, sensor modules, etc
Main application areas:
1. Communication center between the main control system and subsystems
Used for data transmission between device main control units (such as SBC or main controller) and I/O modules, actuators, HMI and other modules
Ensure high-speed and reliable transmission of device action commands and feedback signals between subsystems
2. Communication interface conversion and protocol relay
Provide interface bridging between different protocols (such as RS-232 to TTL, CAN to serial, etc.)
Support cross module or multi subsystem linkage operations
3. Status monitoring and data collection
Transmitting real-time signals from sensors or detection circuits (such as temperature, pressure, position, etc.)
Assist in achieving closed-loop control and process data recording
4. System diagnosis and remote maintenance support
Ability to interface with external PC, HMI, or remote control systems
Support device log upload, remote upgrade, system debugging and other functions
2.产 品 展 示
3.其他产品
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