Tokyo Electron 381-600290-7控制主板卡件 PDF资料
1.产 品 资 料 介 绍：
中文资料：
TEL Tokyo Electron 381-600290-7 控制主板卡件简介
一、基本信息
产品型号：381-600290-7
产品名称：控制主板卡件（AD Mother Board）
制造商：Tokyo Electron Ltd.（TEL）
卡件类型：主控系统模块之一，常用于信号处理与设备管理控制架构中
二、功能描述
信号处理核心
用于接收、转换并调度来自各个子系统的模拟或数字信号，是设备数据传输的中枢。主控通信桥接
与主CPU板、I/O模块、传感器板等进行联动，构成设备核心控制网络。设备逻辑控制平台
通过软件定义的逻辑控制机制协调设备执行动作，如气阀切换、温控反馈、流量调节等。
三、应用领域
广泛应用于 TEL 的半导体工艺设备中，特别是蚀刻机、CVD、涂胶显影设备等。
常用于控制系统的主干线路中，是信号分发和系统运行逻辑的关键模块。
适合设备的定期维护、故障更换或系统升级所使用的替代卡件。
四、使用建议
检查硬件兼容性：与目标设备的控制架构、背板信号标准及电压规格保持一致。
遵循安装流程：确保在断电情况下进行更换，插接过程中避免弯折或接触不良。
运行前测试：更换或维修完成后应进行通电功能测试，确认控制逻辑正常。
定期维护检查：重点检查接插件、电容、电阻元件和PCB焊点的可靠性，防止老化失效。
英文资料：
Introduction to TEL Tokyo Electron 381-600290-7 Control Motherboard Card
1、 Basic Information
Product model: 381-600290-7
Product Name: Control Motherboard Card (AD Mother Board)
Manufacturer: Tokyo Electron Ltd. (TEL)
Card type: One of the main control system modules, commonly used in signal processing and equipment management control architecture
2、 Function Description
Signal processing core
Used to receive, convert, and schedule analog or digital signals from various subsystems, it is the hub of device data transmission.
Main control communication bridge
Integrate with the main CPU board, I/O modules, sensor board, etc. to form the core control network of the device.
Equipment Logic Control Platform
Coordinate device execution actions through software defined logic control mechanisms, such as valve switching, temperature control feedback, flow regulation, etc.
3、 Application Fields
Widely used in TEL's semiconductor process equipment, especially etching machines CVD、 Glue coating and developing equipment, etc.
Commonly used in the backbone circuit of control systems, it is a key module for signal distribution and system operation logic.
Alternative cards suitable for regular maintenance, fault replacement, or system upgrades of equipment.
4、 Usage suggestions
Check hardware compatibility: Maintain consistency with the control architecture, backplane signal standards, and voltage specifications of the target device.
Follow the installation process: Ensure replacement is carried out in the event of power failure, and avoid bending or poor contact during the insertion process.
Pre operation testing: After replacement or repair, a power on function test should be conducted to confirm that the control logic is normal.
Regular maintenance inspection: Focus on checking the reliability of connectors, capacitors, resistor components, and PCB solder joints to prevent aging and failure.
2.产 品 展 示
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