Tokyo Electron SVB-20MVE-ADV2信号总线背板 PDF资料
1.产 品 资 料 介 绍：
中文资料：
TEL Tokyo Electron SVB-20MVE-ADV2 信号总线背板 是东京电子（TEL）半导体设备内部用于模块间通信和电气连接的高性能背板模块，主要作为多个功能板卡的通信平台和电源分发中心。它构成了设备电子系统的“骨干通道”，对整体控制系统的稳定运行具有关键意义。
一、产品基本信息
| 项目 | 内容 |
|---|---|
| 产品名称 | 信号总线背板（Signal Bus Backplane） |
| 产品型号 | SVB-20MVE-ADV2 |
| 制造厂商 | Tokyo Electron Ltd.（东京电子） |
| 模块类型 | 背板式通信与电源接口平台 |
二、主要功能
信号传输平台
提供统一的数据总线结构，实现多个功能模块之间的高效信号交换；
支持数字信号、模拟信号和控制信号的统一路由。
模块化接口支持
设计有多个标准插槽（如VME、CPCI等），支持控制卡件、I/O卡件、监控模块等直接插入；
每个插槽具有标准化的信号/电源接口，保证即插即用与维护便利。
电源分配与保护
背板内部集成了电源轨道，可为多个板卡提供不同电压等级的稳定供电（如±12V、+5V、+3.3V）；
同时具备电源过流/短路保护机制，提升系统整体可靠性。
三、应用领域
半导体设备主控系统
应用于TEL的涂胶显影、蚀刻、清洗、热处理等设备中的中央控制架构；
承载控制CPU板、I/O模块、温控卡件、通信接口等多个功能单元。
工艺自动化控制平台
在多板协同工作的系统中作为主通信载体，维持高带宽、高稳定的信号通道；
支持复杂动作流程中的实时响应和多任务处理。
设备维护与模块化扩展
便于更换或扩展功能板卡，无需大幅改动设备结构；
是设备长期运行中不可缺少的结构部件之一。
英文资料：
The TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane is a high-performance backplane module used for inter module communication and electrical connections within Tokyo Electronics (TEL) semiconductor equipment. It mainly serves as a communication platform and power distribution center for multiple functional boards. It constitutes the "backbone channel" of the device electronic system and is of crucial importance for the stable operation of the overall control system.
1、 Basic Product Information
Project Content
Product Name: Signal Bus Backplane
Product model SVB-20MVE-ADV2
Manufacturer Tokyo Electron Ltd
Module type Backplane communication and power interface platform
2、 Main functions
Signal transmission platform
Provide a unified data bus structure to achieve efficient signal exchange between multiple functional modules;
Support unified routing of digital signals, analog signals, and control signals.
Modular interface support
Design with multiple standard slots (such as VME, CPCI, etc.), supporting direct insertion of control cards, I/O cards, monitoring modules, etc;
Each slot has standardized signal/power interfaces, ensuring plug and play and easy maintenance.
Power distribution and protection
The backplane integrates power rails internally, which can provide stable power supply of different voltage levels (such as ± 12V,+5V,+3.3V) for multiple boards;
Simultaneously equipped with power overcurrent/short circuit protection mechanism to enhance the overall reliability of the system.
3、 Application Fields
Semiconductor equipment control system
The central control architecture used in TEL's adhesive development, etching, cleaning, heat treatment and other equipment;
Carrying multiple functional units such as control CPU board, I/O module, temperature control card, communication interface, etc.
Process automation control platform
As the main communication carrier in a multi board collaborative system, maintain a high bandwidth and high stability signal channel;
Support real-time response and multitasking in complex action processes.
Equipment maintenance and modular expansion
Easy to replace or expand functional boards without requiring significant changes to the device structure;
It is one of the essential structural components in the long-term operation of equipment.
2.产 品 展 示
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