TEL Tokyo Electron BX81-070011-11接口模块 PDF资料
1.产 品 资 料 介 绍：
中文资料：
产品型号： TEL Tokyo Electron BX81-070011-11
产品类型： 接口模块（Interface Module）
功能定位： 半导体设备中实现信号、数据或控制指令输入/输出连接的关键中间层模块
一、产品功能概述：
BX81-070011-11 接口模块是 Tokyo Electron（TEL）用于其半导体设备内部子系统间信号连接的专用模块。它在主控制系统与执行单元、传感器之间起桥接作用，用于信号传输、协议转换、数据缓冲及连接拓展。其设计高度模块化，便于设备功能扩展、维护和升级。
二、主要应用领域：
信号输入输出桥接
连接主控系统与外部 I/O 模块、阀门控制单元、传感器等，保障数字/模拟信号的准确传输。
设备子系统间通信协调
支持不同子模块间的数据交互，如温控单元、气体输送系统、电源控制系统等。
接口标准转换与隔离
执行电气信号电平转换（TTL/RS-232/485等），并提供光电隔离以增强系统抗干扰能力。
系统集成与模块扩展
提供标准化接口，为设备增加额外的通信通道或控制功能提供支持。
故障隔离与维护便捷性提升
通过模块化结构，便于故障快速定位、更换及系统升级。
英文资料：
Product model: TEL Tokyo Electron BX81-070011-11
Product type: Interface Module
Functional positioning: A key intermediate layer module in semiconductor equipment that enables input/output connections for signals, data, or control commands
1、 Product Function Overview:
The BX81-070011-11 interface module is a dedicated module used by Tokyo Electron (TEL) for signal connections between internal subsystems of its semiconductor equipment. It serves as a bridge between the main control system, execution units, and sensors, and is used for signal transmission, protocol conversion, data buffering, and connection expansion. Its design is highly modular, making it easy to expand, maintain, and upgrade device functions.
2、 Main application areas:
Signal input/output bridging
Connect the main control system with external I/O modules, valve control units, sensors, etc. to ensure accurate transmission of digital/analog signals.
Communication and coordination between equipment subsystems
Support data exchange between different submodules, such as temperature control units, gas delivery systems, power control systems, etc.
Interface standard conversion and isolation
Perform electrical signal level conversion (TTL/RS-232/485, etc.) and provide optoelectronic isolation to enhance the system's anti-interference capability.
System integration and module expansion
Provide standardized interfaces to support additional communication channels or control functions for devices.
Improved fault isolation and maintenance convenience
Through modular structure, it is easy to quickly locate faults, replace them, and upgrade the system.
2.产 品 展 示
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