TEL Tokyo Electron 1B80-002391-11控制主板卡件 PDF资料
1.产 品 资 料 介 绍：
中文资料：
TEL Tokyo Electron 1B80-002391-11 控制主板卡件（Control Main Board） 是一块核心控制类印刷电路板，主要用于TEL半导体制造设备中承担系统级的逻辑控制、信号调度、子模块协调与工艺流程管理等任务。它是设备内部多个子系统之间的中枢“主控模块”，在系统的整体运行中处于关键地位。
一、基本信息
产品名称：控制主板卡件 / 主控板
产品型号：1B80-002391-11
制造商：Tokyo Electron Ltd.（TEL）
功能分类：系统级逻辑控制、子系统调度控制
典型位置：安装于主控电气柜、机架内部或控制接口单元中
二、主要功能
设备主控制逻辑执行
管理设备开机初始化、工艺流程逻辑、关机次序等；
实现对各子模块（气路、阀控、电源、搬运等）的协调控制。
接口管理
集成多个通信接口（I/O 总线、串口、CAN、Ethernet等），用于连接 I/O 板卡、传感器、驱动单元。
数据采集与处理
处理来自传感器板、输入卡件等的反馈数据，实时响应控制策略。
与上位系统通信
与主机或工程站通信，支持配方下载、参数调整、日志上传等功能。
三、应用设备类型（部分）
该主控板卡可部署于以下TEL设备类型中：
Etcher（干法刻蚀设备）
控制真空泵、等离子源、气体混合模块等核心功能。
CVD/ALD设备
管理温控区、化学源供给、反应腔操作等子系统。
Coater/Developer（光刻显影设备）
协调晶圆搬送、旋转、显影、加热等功能单元。
Transfer Robot系统
统一控制机械臂运动轨迹、限位反馈与手爪动作等。
英文资料：
The TEL Tokyo Electron 1B80-002391-11 Control Main Board is a core control printed circuit board mainly used in TEL semiconductor manufacturing equipment to undertake system level logic control, signal scheduling, submodule coordination, and process flow management tasks. It is the central "control module" between multiple subsystems within the device, playing a critical role in the overall operation of the system.
1、 Basic Information
Product Name: Control Motherboard Card/Main Control Board
Product model: 1B80-002391-11
Manufacturer: Tokyo Electron Ltd. (TEL)
Functional classification: System level logic control, subsystem scheduling control
Typical location: Installed inside the main control electrical cabinet, rack, or control interface unit
2、 Main functions
Execution of equipment main control logic
Manage device startup initialization, process logic, shutdown sequence, etc;
Realize coordinated control of various sub modules (gas circuit, valve control, power supply, handling, etc.).
Interfaces
Integrate multiple communication interfaces (I/O bus, serial port, CAN, Ethernet, etc.) for connecting I/O boards, sensors, and driver units.
data acquisition and processing
Process feedback data from sensor boards, input cards, etc., and respond in real-time to control strategies.
Communicate with the upper system
Communicate with the host or engineering station, support formula download, parameter adjustment, log upload and other functions.
3、 Application device type (partial)
This controller card can be deployed in the following TEL device types:
Etcher (dry etching equipment)
Control core functions such as vacuum pump, plasma source, gas mixing module, etc.
CVD/ALD equipment
Manage subsystems such as temperature control zone, chemical source supply, and reaction chamber operation.
Coater/Developer (Photolithography and Development Equipment)
Coordinate wafer handling, rotation, development, heating and other functional units.
Transfer Robot System
Unified control of robotic arm motion trajectory, limit feedback, and claw movements.
2.产 品 展 示
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