TEL Tokyo Electron 1D81-000096-13传感器模块 PDF资料
1.产 品 资 料 介 绍：
中文资料：
一、基本信息
产品型号：1D81-000096-13
产品名称：传感器模块（Sensor Module）
制造商：TEL（Tokyo Electron Limited，日本东京电子）
产品类型：信号采集/环境监测模块
版本编号：-13（表示第 13 个修订版本或特定配置）
二、主要功能
该传感器模块一般用于 TEL 半导体制造设备中，承担关键监测与数据采集任务，主要功能如下：
| 功能类别 | 描述 |
|---|---|
| 信号采集 | 实时监测温度、压力、位置、流量、气体浓度或其他工艺参数。 |
| 数据传输 | 将采集的信号转换为数字/模拟数据，传送至主控制系统。 |
| 设备状态反馈 | 检测目标状态（如腔体真空、液位、阀门开闭等）并反馈给主控逻辑。 |
| 工艺监控 | 用于过程参数稳定控制，保障工艺重复性与一致性。 |
三、典型应用领域
该模块多用于以下 TEL 系统中，用于关键工艺状态监控：
CVD / ALD 薄膜沉积设备
监测沉积室的温度、压力、气体流速等。
Etch 蚀刻设备（如 Tactras 系列）
监测等离子腔内气压、RF 功率反射、冷却水温等参数。
光刻前处理设备（如 ACT 系列）
检测加热/冷却板温度、显影压力、喷淋量、气体泄露等。
真空/搬运模块
检测腔体开关状态、夹持压力、传输臂位置反馈等。
英文资料：
1、 Basic Information
Product Model: 1D81-000096-13
Product Name: Sensor Module
Manufacturer: TEL (Tokyo Electron Limited, Tokyo Electronics, Japan)
Product type: Signal acquisition/environmental monitoring module
Version number: -13 (indicating the 13th revision or specific configuration)
2、 Main functions
This sensor module is generally used in TEL semiconductor manufacturing equipment to undertake key monitoring and data acquisition tasks. Its main functions are as follows:
Functional category description
Real time monitoring of temperature, pressure, position, flow rate, gas concentration, or other process parameters through signal acquisition.
Data transmission converts the collected signals into digital/analog data and transmits them to the main control system.
The device status feedback detects the target status (such as chamber vacuum, liquid level, valve opening and closing, etc.) and feeds it back to the main control logic.
Process monitoring is used for stable control of process parameters, ensuring process repeatability and consistency.
3、 Typical application areas
This module is commonly used in the following TEL systems for monitoring critical process status:
CVD/ALD thin film deposition equipment
Monitor the temperature, pressure, gas flow rate, etc. of the sedimentation chamber.
Etch etching equipment (such as Tactras series)
Monitor parameters such as plasma chamber pressure, RF power reflection, and cooling water temperature.
Photolithography pre-processing equipment (such as ACT series)
Detect heating/cooling plate temperature, development pressure, spray volume, gas leakage, etc.
Vacuum/handling module
Detect the status of the chamber switch, clamping pressure, transmission arm position feedback, etc.
2.产 品 展 示
3.其他产品
4.其他英文产品
RADISYS 61-0159-03 CPU circuit board
RADISYS 61-0158-04 CPU Control Card
ASEA DSQC100 connector backplane
| 33VM52-000-4 | 3090-MCI101 | IC3600VBCU1B |
| 33VM52-000-29 | 3090-CAB108 | IC3600VBCU1 |
| 33VM52-000-20 | 3050-SD200 | IC3600VANB1D |
| 33VM52-000-19 | 3050-SD100 | IC3600VANB1 |
| 33VM52-000-13 | 3050-SD-300 | IC3600VANA1G1E |
| 33VM2-12-T2 | 3050-PIF-85 | IC3600VANA1D1 |
| 339-E-P5-G5-L-E-S-N-N-SN-N-N | 3050-PIF-3 | IC3600VANA1D |
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