TEL Tokyo Electron 3D81-000044-V3处理器模块 PDF资料
1.产 品 资 料 介 绍:
中文资料:
TEL Tokyo Electron 3D81-000044-V3 处理器模块 是 Tokyo Electron 半导体制造设备中关键的控制与数据处理组件,通常作为整机系统的主控核心或分布式智能控制节点使用。此模块具备高计算能力、工业级稳定性以及多种通信接口,适配 TEL 多种先进设备中的实时控制与运算需求。
一、产品基本信息
产品型号:3D81-000044-V3
产品名称:处理器模块(Processor Module)
所属系统:TEL 半导体制造设备控制平台
功能定位:嵌入式控制计算模块 / 主控或子控单元
二、核心功能与作用
功能类别 | 详细说明 |
---|---|
设备主控逻辑处理 | 执行工艺流程控制逻辑、动作序列安排、状态管理。 |
数据采集与处理 | 实时处理传感器信号(温度、压力、气体流量等)并作出响应。 |
通信协调 | 与上位系统(如 HMI、MES)、其他控制板卡通信。支持多协议(如 RS-232、Ethernet、CAN)。 |
故障检测与报警 | 提供设备运行监控、故障自诊断与异常状态报警功能。 |
实时多任务控制 | 同时协调多个子系统工作,如加热系统、真空系统、搬运系统等。 |
三、适用设备系统(示例)
3D81-000044-V3 处理器模块广泛集成于以下 TEL 装备系统中:
系统名称 | 可能用途 |
---|---|
TEL Unity™ II CVD | 控制薄膜沉积腔体流程与温度控制系统。 |
TEL Telius™ Etch | 控制等离子蚀刻参数,如RF电源、气体流量、腔体真空等。 |
TEL Trias™ ALD | 控制原子层沉积的精确脉冲控制及气流路径切换。 |
TEL Clean Track™ 系列 | 用于晶圆处理系统(如显影、清洗)中的动作控制。 |
英文资料:
The TEL Tokyo Electron 3D81-000044-V3 processor module is a critical control and data processing component in Tokyo Electron semiconductor manufacturing equipment, typically used as the main control core or distributed intelligent control node of the entire system. This module has high computing power, industrial grade stability, and multiple communication interfaces, suitable for real-time control and computing needs in various advanced TEL devices.
1、 Basic Product Information
Product model: 3D81-000044-V3
Product Name: Processor Module
System: TEL Semiconductor Manufacturing Equipment Control Platform
Functional positioning: Embedded control computing module/main control or sub control unit
2、 Core functions and roles
Detailed description of functional categories
The main control logic of the equipment handles the execution of process flow control logic, action sequence arrangement, and status management.
Real time data collection and processing of sensor signals (temperature, pressure, gas flow, etc.) and response.
Communication coordination and communication with upper level systems (such as HMI, MES) and other control boards. Supports multiple protocols (such as RS-232, Ethernet, CAN).
Fault detection and alarm provide equipment operation monitoring, fault self diagnosis, and abnormal state alarm functions.
Real time multitasking control simultaneously coordinates the work of multiple subsystems, such as heating systems, vacuum systems, handling systems, etc.
3、 Applicable equipment system (example)
The 3D81-000044-V3 processor module is widely integrated into the following TEL equipment systems:
Possible uses of system name
TEL Unity ™ II CVD controlled thin film deposition chamber process and temperature control system.
TEL Telius ™ Etch controls plasma etching parameters such as RF power supply, gas flow rate, chamber vacuum, etc.
TEL Trias ™ Accurate pulse control and airflow path switching for ALD controlled atomic layer deposition.
TEL Clean Track ™ The series is used for motion control in wafer processing systems such as development and cleaning.
2.产 品 展 示
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