KLA Tencor 710-651836-20前置放大器模块 PDF资料
1.产 品 资 料 介 绍：
中文资料：
KLA Tencor 710-651836-20 前置放大器模块（Preamplifier Module） 是专为KLA Tencor的光学检测与量测系统设计的一款高灵敏度信号放大单元，主要用于对微弱模拟信号进行初级放大和调理，以便后续处理模块能准确采集并分析数据。它在半导体晶圆缺陷检测、成像系统或激光测量系统中起着至关重要的作用。
一、产品概况
产品型号：710-651836-20
类型：前置放大器模块（Preamplifier Module）
制造商：KLA Tencor
功能定位：用于对低电平模拟信号进行高增益、低噪声放大
适配平台：KLA Tencor 710 系列检测与量测设备
二、核心功能
| 功能模块 | 描述 |
|---|---|
| 低噪声放大 | 对来自光电探测器、传感器或探头的微弱信号进行初级放大，提高信噪比（SNR） |
| 信号调理 | 包含滤波、偏置调整、带宽控制等功能，使输出信号适配后端采样或数字化模块 |
| 高频响应 | 支持高速采样设备的需求，适用于动态测量和高速成像系统 |
| 电磁屏蔽与稳定性 | 具备良好的EMI屏蔽设计，保证在工业复杂环境中运行稳定可靠 |
三、应用领域
1. 晶圆表面缺陷检测系统
连接CCD、CMOS、APD（雪崩光电二极管）等检测器，用于对微弱光电信号进行前端处理。
在扫描过程中增强图像对比度，提高缺陷分辨能力。
2. 光学量测系统
接收干涉仪、激光反射信号并进行预放大，用于测量晶圆表面形貌、膜厚等物理参数。
可配合Z轴反馈系统实现动态调焦与追踪。
3. e-beam电子束成像系统
对次级电子信号或电流信号进行高带宽放大，实现清晰图像采集。
在低剂量成像条件下尤为重要，有助于保持高灵敏度。
4. 自动对位系统
放大微弱对位信号（如激光对射或条纹干涉信号）并输出至控制器，提高系统对准精度。
英文资料：
The KLA Tencor 710-651836-20 Preamplifier Module is a high-sensitivity signal amplification unit designed specifically for the optical detection and measurement system of KLA Tencor. It is mainly used for primary amplification and conditioning of weak analog signals, so that subsequent processing modules can accurately collect and analyze data. It plays a crucial role in semiconductor wafer defect detection, imaging systems, or laser measurement systems.
1、 Product Overview
Product model: 710-651836-20
Type: Preamplifier Module
Manufacturer: KLA Tencor
Function positioning: Used for high gain and low noise amplification of low-level analog signals
Adaptation platform: KLA Tencor 710 series detection and measurement equipment
2、 Core functions
Function module description
Low noise amplification performs primary amplification on weak signals from photodetectors, sensors, or probes to improve signal-to-noise ratio (SNR)
Signal conditioning includes filtering, bias adjustment, bandwidth control, and other functions to adapt the output signal to the backend sampling or digitization module
High frequency response supports the demand for high-speed sampling equipment, suitable for dynamic measurement and high-speed imaging systems
Electromagnetic shielding and stability have good EMI shielding design, ensuring stable and reliable operation in complex industrial environments
3、 Application Fields
1. Wafer surface defect detection system
Connect CCD, CMOS, APD (avalanche photodiode) and other detectors for front-end processing of weak photoelectric signals.
Enhance image contrast and improve defect resolution during the scanning process.
2. Optical measurement system
Receive interferometers, laser reflection signals, and perform pre amplification to measure physical parameters such as wafer surface morphology and film thickness.
Can be combined with Z-axis feedback system to achieve dynamic focusing and tracking.
3. e-beam electron beam imaging system
Amplify secondary electronic signals or current signals with high bandwidth to achieve clear image acquisition.
This is particularly important under low-dose imaging conditions, as it helps maintain high sensitivity.
4. Automatic alignment system
Amplify weak alignment signals (such as laser alignment or stripe interference signals) and output them to the controller to improve system alignment accuracy.
2.产 品 展 示
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