KLA Tencor 720-11200-002背板 PDF资料
1.产 品 资 料 介 绍：
中文资料：
KLA Tencor 720-11200-002 背板 — 产品应用领域详解
1. 半导体制造设备中的关键连接平台
背板作为设备内部多个功能模块（如控制器板、处理板、接口模块、传感器模块等）的统一连接基础，提供高速可靠的电气连接通道。
它确保不同模块之间数据和电源的稳定传输，是设备实现协同工作的重要物理基础。
2. 支持高密度多模块集成
720-11200-002 背板设计用于容纳多块电路板，实现多模块高密度集成，满足半导体检测设备复杂工艺的需求。
适合多轴控制、图像处理、信号采集等多个并行任务的硬件平台整合。
3. 稳定的工业环境适应能力
该背板采用高质量材料和工业标准制造，能在半导体生产车间的高温、振动、尘埃等复杂环境下长期稳定工作。
保障设备长期运行的可靠性和维护简便性。
4. 适配多种KLA检测仪器
720-11200-002背板通常配合 KLA Tencor 的各种晶圆检测系统、缺陷检测设备、掩膜版检查仪等使用。
提供统一的机械和电气接口，方便设备升级和模块更换。
5. 保障信号完整性和高速传输
背板设计注重信号完整性，支持高速数字信号和模拟信号的传输，确保检测数据的准确采集与处理。
有助于实现设备的高精度检测和实时反馈控制。
6. 便于设备维护与模块扩展
标准化背板设计使设备维修和模块替换更加便捷，缩短维护时间，提高设备可用性。
同时支持后续功能扩展或技术升级，提升设备生命周期。
英文资料：
KLA Tencor 720-11200-002 Backboard - Product Application Field Detailed Explanation
1. Key Connection Platforms in Semiconductor Manufacturing Equipment
The backplane serves as a unified connection foundation for multiple functional modules within the device, such as controller boards, processing boards, interface modules, sensor modules, etc., providing high-speed and reliable electrical connection channels.
It ensures stable transmission of data and power between different modules, and is an important physical foundation for devices to achieve collaborative work.
2. Support high-density multi module integration
The 720-11200-002 backplane is designed to accommodate multiple circuit boards, achieve high-density integration of multiple modules, and meet the complex process requirements of semiconductor testing equipment.
Suitable for hardware platform integration of multiple parallel tasks such as multi axis control, image processing, signal acquisition, etc.
3. Stable adaptability to industrial environments
The backplane is made of high-quality materials and industrial standards, and can work stably for a long time in complex environments such as high temperature, vibration, and dust in semiconductor production workshops.
Ensure the reliability and ease of maintenance of equipment for long-term operation.
4. Compatible with multiple KLA detection instruments
The 720-11200-002 backplane is typically used in conjunction with various wafer inspection systems, defect detection equipment, mask inspection devices, and other equipment from KLA Tencor.
Provide unified mechanical and electrical interfaces to facilitate equipment upgrades and module replacements.
5. Ensure signal integrity and high-speed transmission
The backplane design emphasizes signal integrity, supports the transmission of high-speed digital and analog signals, and ensures accurate acquisition and processing of detection data.
Helps to achieve high-precision detection and real-time feedback control of equipment.
6. Easy to maintain equipment and expand modules
Standardized backplane design makes equipment maintenance and module replacement more convenient, shortens maintenance time, and improves equipment availability.
Simultaneously supporting subsequent functional extensions or technological upgrades to enhance the device's lifecycle.
2.产 品 展 示
3.其他产品
ABB REG670 1MRK002826-AC 安全系统组件
4.其他英文产品
AMAT 0190-11415 Digital Input Module
| UR8HH | CACR-IR44SFB | 97-9045-01 |
| UR8HH | CACR-R44SFB | 60-0208-03 |
| UR8GH | CACR-CSL20DL16AAA | 859-8379-001B |
| UR8GH | CACR-SRA5AB | PRE-913425 |
| UR8FV | CACR-UP60AAB | EXP-MX |
| UR8FV | CACR-SR10B21SSY367 | 97-9525-20 |
| UR8FH | CACR-SR05BC1ES-Y278 | EPC5A-CFB001 |
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