KLA Tencor 0271284-000接口板 PDF资料
1.产 品 资 料 介 绍：
中文资料：
KLA Tencor 0271284-000 接口板 – 产品应用领域
该接口板是 KLA Tencor 高端检测和计量设备中的一类信号桥接与数据通信模块。尽管公开资料中对具体电路功能描述不详，但根据型号命名规律与应用背景，可以推断其在以下系统中起到关键作用：
1. 晶圆检测系统中的信号交互与控制桥接
应用于 KLA 的 Surfscan、P-series、eS-series 等晶圆检测设备中；
负责在主控CPU、图像采集单元、驱动器之间进行信号转换和连接；
支持模拟信号、数字信号或光电信号在不同模块间的稳定传输。
2. 数据采集系统接口
在图像处理或激光扫描模块中，将传感器/检测器数据传输至控制系统；
起到数据缓冲、接口匹配（如RS-422、LVDS、TTL）等作用。
3. 控制总线或设备子模块连接
用于连接主控制器与运动控制、电源模块、传感器模块等子系统；
支持多种工业标准接口（如CAN、I²C、SPI、PCI、PXI等）；
可能作为桥接板连接主板与外设。
4. 测试与调试接口模块
提供对系统状态的测试接口，如诊断信号、信号镜像（loopback）、错误检测等；
用于设备工厂调试、例行维护或故障定位。
适用行业与系统场景
| 应用方向 | 场景说明 |
|---|---|
| 半导体检测设备 | 晶圆缺陷检测、CD量测、Overlay对准测量 |
| 自动化平台系统 | 控制系统与运动部件、图像模块之间的电气连接 |
| 光学/激光扫描系统 | 图像传输、光学调整信号同步、电源与地线隔离 |
| 数据通信模块 | 多信号来源之间的数据集成与转换桥接 |
英文资料：
KLA Tencor 027128-000 Interface Board - Product Application Fields
This interface board is a type of signal bridging and data communication module in KLA Tencor's high-end detection and measurement equipment. Although the specific circuit functions are not described in public information, based on the naming conventions and application backgrounds of the models, it can be inferred that they play a key role in the following systems:
Signal interaction and control bridging in wafer inspection system
Applied to KLA's wafer inspection equipment such as Surfscan, P-series, eS series, etc;
Responsible for signal conversion and connection between the main control CPU, image acquisition unit, and driver;
Support stable transmission of analog signals, digital signals, or optoelectronic signals between different modules.
2. Interface of data collection system
In the image processing or laser scanning module, transmit sensor/detector data to the control system;
Plays a role in data buffering, interface matching (such as RS-422, LVDS, TTL), etc.
3. Control bus or device submodule connection
Used to connect the main controller with subsystems such as motion control, power module, sensor module, etc;
Support multiple industrial standard interfaces (such as CAN, I ² C, SPI, PCI, PXI, etc.);
It may serve as a bridge board to connect the motherboard and peripherals.
4. Testing and Debugging Interface Module
Provide testing interfaces for system status, such as diagnostic signals, signal loopback, error detection, etc;
Used for equipment factory debugging, routine maintenance, or fault location.
Applicable industries and system scenarios
Application direction scenario description
Semiconductor testing equipment includes wafer defect detection, CD measurement, and overlay alignment measurement
Electrical connections between the control system of the automation platform system and the moving parts and image modules
Optical/laser scanning system image transmission, optical adjustment signal synchronization, power and ground isolation
Data integration and conversion bridging between multiple signal sources in the data communication module
2.产 品 展 示
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| F46GENA-R2-NS-NV-00 | HG102A607 | NSSM01 |
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