KLA Tencor 073-650203-00 硬度板 PDF资料
1.产 品 资 料 介 绍：
中文资料：
KLA Tencor 073-650203-00 硬度板 – 应用领域与功能分析
一、可能的定义与功能定位
“硬度板”在半导体制造与检测设备中一般不是指传统意义上的“材料硬度测试”，而更可能是以下几类用途中的一种：
1. 信号调节或稳定性控制模块
“Hardness”在设备领域中有时指的是信号处理过程中的“强度调整”或“滤波硬度”，用于增强信号的抗干扰性。
本板卡可能承担对图像、激光或探测器信号进行滤波、增益调节或数字稳定的任务。
2. 结构补强/硬化控制板（板载电源/稳压）
在高速、高敏感性设备中，为避免温漂、震动等引发系统误差，硬度板可能也用于“电气硬化”或“噪声屏蔽”处理，起到稳定电子信号、提升抗干扰能力的作用。
3. 用于高精度检测设备中的控制子板
可能作为主控系统中的辅助板卡，对特定功能模块（如对位系统、激光测距、边缘识别）提供专用的信号驱动或反馈处理功能。
二、典型应用领域（推测）
1. 晶圆检测设备（如SP、Surfscan系列）
对晶圆表面进行缺陷检测时，硬度板可协助处理来自CCD/CMOS图像传感器或激光扫描器的高精度数据。
2. 计量量测设备（如CD SEM、Overlay量测）
对微结构几何参数进行精准量测，硬度板可能承担稳定控制功能，保证数据输出的一致性和可重复性。
3. 自动化过程控制系统
用于调整马达驱动信号、平台位移精度控制，也可能与伺服系统、直线电机等配套使用。
4. 环境补偿与设备校准系统
在设备热漂移或震动影响较大的情况下，该板可能参与温度、电源、电信号的硬化调节过程，提升系统鲁棒性。
英文资料：
KLA Tencor 073-650203-00 Hardness Plate - Application Fields and Functional Analysis
1、 Possible definitions and functional positioning
In semiconductor manufacturing and testing equipment, "hardness board" generally does not refer to the traditional "material hardness testing", but is more likely to be one of the following types of applications:
1. Signal conditioning or stability control module
Hardness "in the field of equipment sometimes refers to the" strength adjustment "or" filtering hardness "in the signal processing process, used to enhance the anti-interference ability of signals.
This board may be responsible for filtering, gain adjustment, or digital stabilization of image, laser, or detector signals.
2. Structural reinforcement/hardening control board (onboard power supply/voltage regulator)
In high-speed and high-sensitivity equipment, to avoid system errors caused by temperature drift, vibration, etc., hardness plates may also be used for "electrical hardening" or "noise shielding" treatment, which stabilizes electronic signals and enhances anti-interference ability.
3. Control board used in high-precision detection equipment
It may serve as an auxiliary board in the main control system, providing dedicated signal driving or feedback processing functions for specific functional modules such as alignment systems, laser ranging, and edge recognition.
2、 Typical application areas (speculated)
1. Wafer inspection equipment (such as SP, Surfscan series)
When performing defect detection on wafer surfaces, hardness plates can assist in processing high-precision data from CCD/CMOS image sensors or laser scanners.
2. Measurement equipment (such as CD SEM, Overlay measurement)
Accurately measuring the geometric parameters of microstructures, the hardness plate may serve as a stabilizing control function to ensure consistency and repeatability of data output.
3. Automated process control system
Used for adjusting motor drive signals, controlling platform displacement accuracy, and may also be used in conjunction with servo systems, linear motors, etc.
4. Environmental compensation and equipment calibration system
In situations where equipment thermal drift or vibration has a significant impact, the board may participate in the hardening adjustment process of temperature, power supply, and electrical signals, improving system robustness.
2.产 品 展 示
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