KLA Tencor 710-655651-20图像传感器板组件 PDF资料
1.产 品 资 料 介 绍：
中文资料：
KLA Tencor 710-655651-20 图像传感器板组件
产品概述
KLA Tencor 710-655651-20 是一款用于高端晶圆检测与计量设备中的图像传感器板组件，其核心功能是将通过光学系统采集的图像信号进行接收、转换、放大和初步处理。这种模块通常包含高分辨率图像传感器（如CCD或CMOS），并与图像采集系统紧密协作，用于实现对晶圆表面、结构缺陷、光刻对准标记等目标的精准视觉分析。
核心功能
图像信号采集与转换
接收来自光学系统的反射或透射图像信号，并通过图像传感器将其转化为电信号。
模拟-数字转换（ADC）
将图像传感器输出的模拟信号转化为数字图像数据，便于后续图像处理与分析。
噪声过滤与增益控制
内置前置放大电路及低噪声滤波器，提高图像信噪比，保证检测灵敏度。
接口通信与同步控制
与系统主控板或图像处理单元通过高速数据接口（如LVDS、Camera Link、PCIe等）传输图像数据，同时接受同步触发与控制信号。
技术特点
| 项目 | 描述 |
|---|---|
| 传感器类型 | 高灵敏度 CCD 或 CMOS |
| 图像分辨率支持 | 高达几百万像素（具体视机型而定） |
| 采样精度 | 12 位或更高 ADC |
| 数据接口 | 高速串行数字传输接口，如LVDS或定制背板接口 |
| 布局形式 | 多层 PCB 板，紧凑集成光电及控制电路 |
| 电磁干扰抑制 | 内置滤波与地线设计，保证信号完整性 |
| 工作温度范围 | 0°C ～ 50°C，适应洁净室环境 |
英文资料：
KLA Tencor 710-655651-20 Image Sensor Board Component
product overview
KLA Tencor 710-655651-20 is an image sensor board component used in high-end wafer inspection and metrology equipment. Its core function is to receive, convert, amplify, and preliminarily process image signals collected through an optical system. This type of module typically includes high-resolution image sensors (such as CCD or CMOS) and works closely with image acquisition systems to achieve precise visual analysis of targets such as wafer surfaces, structural defects, and photolithography alignment marks.
Core functions
Image signal acquisition and conversion
Receive reflected or transmitted image signals from optical systems and convert them into electrical signals through image sensors.
Analog to Digital Conversion (ADC)
Convert the analog signal output by the image sensor into digital image data for subsequent image processing and analysis.
Noise filtering and gain control
Built in preamplifier circuit and low-noise filter to improve image signal-to-noise ratio and ensure detection sensitivity.
Interface Communication and Synchronization Control
Transmit image data to the system main control board or image processing unit through high-speed data interfaces (such as LVDS, Camera Link, PCIe, etc.), while receiving synchronous triggering and control signals.
FEATURES
Project Description
Sensor type: High sensitivity CCD or CMOS
Image resolution supports up to several million pixels (depending on the model)
Sampling accuracy 12 bit or higher ADC
High speed serial digital transmission interface for data interface, such as LVDS or customized backplane interface
Layout form: Multi layer PCB board, compact integrated optoelectronic and control circuits
Electromagnetic interference suppression with built-in filtering and grounding design to ensure signal integrity
Working temperature range: 0 ° C to 50 ° C, suitable for clean room environment
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