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LAM 810-072906-005连接背板电路板

LAM 810-072906-005连接背板电路板

LAM 810-072906-005连接背板电路板 PDF资料1.产 品 资 料 介 绍:中文资料:LAM 810-072906-005 是一款用于半导体制造设备的连接背板电路板(Backplane Circuit Board)。背板电路板在复杂的电子系统中起着至关重要的作用,通常用于连接多个电路模块或组件,提供电气连接和信号传输的通道。主要特性和功能:模块互联:背板电路板用于连接多个独立的电路模...

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LAM 810-072906-005连接背板电路板

    LAM 810-072906-005连接背板电路板 PDF资料

    1.产 品 资 料 介 绍:

    中文资料:

    LAM 810-072906-005 是一款用于半导体制造设备的连接背板电路板(Backplane Circuit Board)。背板电路板在复杂的电子系统中起着至关重要的作用,通常用于连接多个电路模块或组件,提供电气连接和信号传输的通道。

    主要特性和功能:

    • 模块互联:背板电路板用于连接多个独立的电路模块或组件,如控制模块、传感器模块、驱动模块等,确保它们之间的电气信号和电源分配的顺畅传输。
    • 高可靠性:设计用于严苛的工业环境,特别是在半导体制造设备中,确保长期稳定的运行和可靠的信号传输。
    • 高密度连接:支持高密度的连接器配置,能够容纳多个连接器接口,适应复杂的电路设计需求。
    • 信号完整性:设计中注重信号完整性,减少电磁干扰(EMI)和串扰,确保高频信号的准确传输。
    • 模块化设计:模块化的设计允许设备制造商根据具体应用需求对背板进行配置和扩展,增强系统的灵活性和适应性。
    • 散热设计:背板电路板通常集成了良好的散热设计,帮助系统在高功率密度条件下保持稳定运行。

    应用领域:

    • 半导体制造设备:广泛应用于半导体生产线的核心设备中,如蚀刻机、光刻机、沉积设备等,负责连接和集成各个控制模块。
    • 自动化系统:在自动化控制系统中,用于连接控制器、I/O模块和执行器,确保整个系统的协调运行。
    • 测试与测量设备:用于测试仪器和测量设备中,连接各种功能模块,确保测试信号的准确传输。
    • 数据通信系统:在数据通信设备中,用于连接和组织多个通信模块,确保数据传输的稳定性和高效性。

    优势:

    • 可靠性高:背板电路板经过严格的测试和认证,确保在高负载和复杂环境下的可靠性能。
    • 灵活配置:支持多种连接器和模块配置,适应不同设备的设计需求,方便系统扩展和升级。
    • 维护简便:模块化设计使得维护和更换变得更加容易,减少设备停机时间,提升生产效率。
    • 耐用性强:采用高品质材料和精密制造工艺,确保在恶劣的工作环境下依然表现出色。

    英文资料:

    LAM 810-072906-005 is a backplane circuit board used for connecting semiconductor manufacturing equipment. Backplane circuit boards play a crucial role in complex electronic systems, typically used to connect multiple circuit modules or components, providing channels for electrical connections and signal transmission.

    Main features and functions:

    Module interconnection: Backplane circuit boards are used to connect multiple independent circuit modules or components, such as control modules, sensor modules, driver modules, etc., to ensure smooth transmission of electrical signals and power distribution between them.

    High reliability: Designed for harsh industrial environments, especially in semiconductor manufacturing equipment, to ensure long-term stable operation and reliable signal transmission.

    High density connectivity: supports high-density connector configurations, can accommodate multiple connector interfaces, and adapt to complex circuit design requirements.

    Signal integrity: In design, emphasis is placed on signal integrity to reduce electromagnetic interference (EMI) and crosstalk, ensuring accurate transmission of high-frequency signals.

    Modular design: Modular design allows device manufacturers to configure and expand the backplane according to specific application requirements, enhancing the flexibility and adaptability of the system.

    Heat dissipation design: Backplane circuit boards usually integrate good heat dissipation design to help the system maintain stable operation under high power density conditions.

    Application areas:

    Semiconductor manufacturing equipment: widely used in core equipment of semiconductor production lines, such as etching machines, lithography machines, deposition equipment, etc., responsible for connecting and integrating various control modules.

    Automation system: In an automation control system, it is used to connect controllers, I/O modules, and actuators to ensure the coordinated operation of the entire system.

    Testing and measuring equipment: used in testing instruments and measuring devices to connect various functional modules and ensure accurate transmission of testing signals.

    Data communication system: In data communication equipment, it is used to connect and organize multiple communication modules to ensure the stability and efficiency of data transmission.

    Advantages:

    High reliability: The backplane circuit board undergoes rigorous testing and certification to ensure reliable performance under high loads and complex environments.

    Flexible configuration: supports multiple connector and module configurations, adapts to the design requirements of different devices, and facilitates system expansion and upgrades.

    Easy maintenance: Modular design makes maintenance and replacement easier, reducing equipment downtime and improving production efficiency.

    Strong durability: Using high-quality materials and precision manufacturing processes to ensure excellent performance even in harsh working environments.


    2.产      品      展      示      

    b58d97ab8ab275dc89f91cce7bb30f4e_3-240Q4104245N2.jpg


    3.其他产品

    AMAT 0190-27295 功率控制器

    GE VMIVME-7807 单板计算机

    GE IS420PUAAH1A 输入输出模块

    4.其他英文产品

     3BHE039203R0101 Processor module

     3BHE039724R0C3D high-performance control system

     3BHL000391P0101 Low volta power supply chip

    5.更多库存型号

    PMB31D-10100-00AMAT 0100-09362PFEA111 
    PMB33C-00114-02AMAT 0100-00852PFEA113 
    PMB33E-00101-01AMAT 0100-00025PFRL 101A
    PMB31B-20101-01AMAT 0100-20265PFRL 101C
    PMB31B-20114-03AMAT 0100-00015PFTL301E 
    PMB31B-00216-00AMAT 0100-03536PFCL301E 
    PMB33E-00201-03AMAT 0100-35067PFRL101A 0.5KN 3BSE023314R0003

    本篇文章出自瑞昌明盛自动化设备有限公司官网,转载请附上此链接:http://www.jiangxidcs.com

    品牌:LAM


    型号:810-072906-005连接背板电路板


    质保:一年


    成色:全新/二手


    优势产品ABB、GE、FOXBORO、TRICONEX、BENTLY、A-B、MOTOROLA、HONEYWELL 、SCHNEIDER 

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    特点:主营产品各种模块/卡件,控制器,触摸屏,伺服驱动器。


    应用行业:广泛应用于冶金、石油天然气、玻璃制造业、铝业、石油化工、煤矿、造纸印刷、纺织印染、机械、电子制造、汽车制造、烟草、塑胶机械、电力、水利、水处理/环保、市政工程、锅炉供暖、能源、输配电等


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